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Advanced Technology Search Group represents a fast-growing maker of Fiber Optic Connectivity Products for Data Centers. They are building a Co-Packaged Optics group and seek a High Speed Digital Design Engineer to drive high-speed board-level design and integration between host devices and optical technologies.
Ideal candidate holds a BSEE with 3–5+ years in high-speed PCB and electrical hardware design, including experience with 200G/PAM4+ interconnects.
Our client is a very fast-growing maker of Fiber Optic Connectivity Products for Data Centers.
They are starting up a group focused on Co-Packaged Optics (CPO), extending their products deeper into AI Data Centers and working with Optical Engine Technology and Highly Integrated Optoelectronic Components.
They are currently looking for a High Speed Digital Design Engineer who will focus on high-speed complex board level design with expertise in PCB Design, Signal and Power Integrity, systems development, architecture, integration, and material selection between host devices and optical technologies.