Lead 200G+ High-Speed Optical Design Engineer

Viaphoton; Naperville (IL); On-site; USD 80,000 - 150,000; Full time

Benefits offered by this job

Health, dental, and vision coverage

401(k) with match

Flexible PTO

10 paid holidays (2 floating)

Job summary

viaphoton seeks an experienced Electrical Engineer to advance the development of 200G+ systems and interfaces for next‑gen Co‑Packaged Optics. Lead high‑speed data paths from concept to production while mentoring junior engineers.

You will define materials, assess PAM4 interconnects and related standards, and work with SI/EMI tools. Onsite in Naperville, IL with competitive compensation and benefits.

Qualifications

• BS in Electrical Engineering required.
• 3+ years of hands-on high-speed design experience.
• Background in high-speed transceiver or transponder development for 200G/PAM4+ interconnect.
• Experience designing and applying 224G/448G PAM4 or PAM6 interconnect and related standards.
• Strong familiarity with high-speed signaling, PCB technologies, and RF design techniques.

Responsibilities

• Advance development of 200G+ systems and interfaces for NPO and CPO products, including 224G/448G PAM4 signal and SIPI.
• Own technology selection, architecture, development, integration, and productization of cutting-edge CPO solutions.
• Define PCB material selection and stack-ups, and evaluate S-parameters, eye diagrams, crosstalk, jitter, and COM performance.
• Assess host (switch fabric and xPU) and optical technologies, including compute fabrics and scale-up/scale-out topologies.
• Guide the electrical data path from concept to production, and mentor junior design team members.

Skills

High‑speed design

Transceiver development

SI simulation tools

EMI/EMC evaluation

Power integrity

Education

BS in Electrical Engineering

Tools

ADS

HFSS

Job description

viaphoton seeks an experienced Electrical Engineer to advance the development of 200G+ systems and interfaces for next‑gen Co‑Packaged Optics. Lead high‑speed data paths from concept to production while mentoring junior engineers.

You will define materials, assess PAM4 interconnects and related standards, and work with SI/EMI tools. Onsite in Naperville, IL with competitive compensation and benefits.