High-Speed Digital Design Engineer

Viaphoton; Naperville (IL); On-site; USD 80,000 - 150,000; Full time

Benefits offered by this job

Health, dental, and vision coverage

401(k) with match

Flexible PTO

10 paid holidays (2 floating)

Job summary

viaphoton seeks an experienced Electrical Engineer to advance the development of 200G+ systems and interfaces for next‑gen Co‑Packaged Optics. Lead high‑speed data paths from concept to production while mentoring junior engineers.

You will define materials, assess PAM4 interconnects and related standards, and work with SI/EMI tools. Onsite in Naperville, IL with competitive compensation and benefits.

Qualifications

• BS in Electrical Engineering required.
• 3+ years of hands-on high-speed design experience.
• Background in high-speed transceiver or transponder development for 200G/PAM4+ interconnect.
• Experience designing and applying 224G/448G PAM4 or PAM6 interconnect and related standards.
• Strong familiarity with high-speed signaling, PCB technologies, and RF design techniques.

Responsibilities

• Advance development of 200G+ systems and interfaces for NPO and CPO products, including 224G/448G PAM4 signal and SIPI.
• Own technology selection, architecture, development, integration, and productization of cutting-edge CPO solutions.
• Define PCB material selection and stack-ups, and evaluate S-parameters, eye diagrams, crosstalk, jitter, and COM performance.
• Assess host (switch fabric and xPU) and optical technologies, including compute fabrics and scale-up/scale-out topologies.
• Guide the electrical data path from concept to production, and mentor junior design team members.

Skills

High‑speed design

Transceiver development

SI simulation tools

EMI/EMC evaluation

Power integrity

Education

BS in Electrical Engineering

Tools

ADS

HFSS

Job description

We are changing the norm by being customer-focused, technology-led.

viaPhoton builds custom-engineered fiber optic solutions that power AI infrastructure, data centers, and 5G networks for some of the biggest names in tech. In five years we've grown to a team of 200+ and 4x'd our revenue in the last year alone, and we're just getting started. We're looking for dependable, hardworking people who take pride in their work and want to grow with us.

About the Role

You’ll advance the development of 200G+ systems and interfaces for our next‑generation Co‑Packaged Optics (CPO) products, owning the high‑speed electrical data path from concept to production. This is deep, hands‑on signal and power integrity work at the cutting edge of AI data center connectivity, and you’ll guide and mentor junior engineers along the way.

• Advance the development of 200G+ systems and interfaces for our NPO and CPO products, including 224G/448G PAM4 signal and power integrity (SIPI)
• Own technology selection, architecture, development, integration, and productization of cutting‑edge CPO solutions
• Define PCB material selection and stack‑ups, and evaluate S-parameters, eye diagrams, crosstalk, jitter, and COM performance
• Assess host (switch fabric and xPU) and optical technologies, including compute fabrics and scale‑up/scale‑out topologies
• Guide the electrical data path from concept to production, and mentor junior design team members

What You’ll Bring

• Have a BS in Electrical Engineering and 3+ years of hands‑on high‑speed design experience
• Bring a background in high‑speed transceiver or transponder development, ideally for 200G/PAM4+ interconnect
• Have experience designing and applying 224G/448G PAM4 or PAM6 interconnect and related OIF-CEI or IEEE standards
• Are well‑versed in high‑speed signaling fundamentals, channel behavior, PCB technologies, and RF design techniques
• Are comfortable with SI simulation tools such as ADS or HFSS, and with EMI/EMC evaluation and mitigation
• Robust health, dental, and vision coverage that starts on day 1
• 401(k) with match, vests immediately after a 90‑day waiting period
• Flexible PTO that grows over time
• 10 paid holidays, including 2 floating holidays

Schedule: Mon–Fri | Onsite

Compensation: $80,000 - $150,000 base salary, plus annual bonus

At viaPhoton, we are committed to furthering our culture of inclusion. We reinforce this through our core values and beliefs as well as our processes and strategic goals. We remind team members to seek various viewpoints, learn and be hungry with curiosity, and gain trust.

We are an equal opportunity employer and make all employment decisions based on merit and qualifications. We do not discriminate on the basis of race, color, ethnic or national origin, religion or belief, sex, pregnancy, sexual orientation, gender identity or expression, age, disability, health condition, genetic information, marital or family status, military or veteran status, socioeconomic background, or any other status protected by applicable law.

We provide reasonable accommodations and adjustments throughout the hiring process. If you need one, please let us know. Any personal data you share with us is handled confidentially and in line with applicable data protection law.

Having trouble with the link? Copy and paste: https://tinyurl.com/vPBenefits

Are you at least 18 years of age or older?

Will you now or in the future require employer sponsorship for a work visa or immigration benefit (for example, H-1B or a green card petition)?

This role is located in Naperville, IL, are you able to work onsite 5 days a week?

Have you ever worked at viaPhoton before?

What is your desired compensation range?

We use Greenhouse’s AI-powered Talent Matching tool to compare your application against our job requirements.