High-Impact Process Engineer Intern – Semiconductor Fab

Micron Technology, Inc.; Boise (ID); On-site; USD 12,000 - 18,000; Full time

Job summary

Micron Technology, Inc. seeks an ID1 High Volume Manufacturing Process Engineer Intern to support process optimization, yield improvement, and cost reduction initiatives at the Boise site.

You will collaborate with equipment teams, operations leaders and cross-functional partners to ensure area metrics are met and wafer output is optimized. This internship requires knowledge of SPC/DOE and scripting (Python/Java) with data visualization in Tableau/Matlab; Spring 2026 and Summer 2026 scheduling

Qualifications

• Current student in an engineering or related degree program; graduation date not before September 2027.
• Understanding of SPC and Design of Experiments.
• Proficiency in one or more scripting/programming tools (Python, Java) and visualization tools (Tableau, Matlab, Microsoft Suite).

Responsibilities

• Finish the required safety training and adhere to safety policies and laws.
• Ensure proper tool documentation and update reaction mechanisms as needed.
• Supervise and resolve issues impacting yield, excursions, defects, or output loss.
• Apply SPC, FDC, and 8D methodologies to optimize processes and improve tool availability.
• Utilize AI-enabled tools and data analytics solutions to improve engineering productivity, accelerate problem solving, and support process optimization activities.
• Analyze data using engineering knowledge and visualization tools to make critical process decisions.
• Perform project work to optimize wafer processing and increase wafer outs.
• Update or create procedures to align with area and global practices.

Education

Engineering degree program

Tools

Python

Java

Tableau

Matlab

Microsoft Excel

Job description

Micron Technology, Inc. seeks an ID1 High Volume Manufacturing Process Engineer Intern to support process optimization, yield improvement, and cost reduction initiatives at the Boise site.

You will collaborate with equipment teams, operations leaders and cross-functional partners to ensure area metrics are met and wafer output is optimized. This internship requires knowledge of SPC/DOE and scripting (Python/Java) with data visualization in Tableau/Matlab; Spring 2026 and Summer 2026 scheduling