Head of Co-Packaged Optics Packaging

Q.ANT; Austin (TX); On-site; USD 180,000 - 250,000; Full time

Job summary

Q.ANT is seeking a Team Lead Co-Packaged Optics to anchor the architecture of our next-generation semiconductor packaging. You will build and scale a new CPO Packaging Team, bridging chip design with external OSAT manufacturing and driving high-volume production readiness.

You’ll own technical direction across photonics and electronics, lead cross-functional collaboration, and implement rigorous DFM and reliability qualification standards to ensure robust, scalable packaging solutions.

Qualifications

• Bachelor’s or Master’s degree in Electrical Engineering, Materials Science, Physics, or related field.
• 5+ years experience in Semiconductor Packaging (Back-End/OSAT).
• Hands-on experience with Co-Packaged Optics packaging and fiber attachment.
• Experience building and scaling engineering teams.
• Fluent English; German a plus for local stakeholders.

Responsibilities

• Build, mentor, and lead a CPO Packaging engineering team.
• Own evaluation and management of global OSAT partners.
• Drive development of co-packaged photonic/electronic assemblies.
• Implement Design for Manufacturability guidelines.
• Interface between Chip Design, Systems, Manufacturing, and Supply Chain.
• Lead root-cause analysis for reliability or process deviations.

Skills

Leadership

OSAT expertise

CPO packaging

Fiber attachment

DFM

Cross-functional

Communication

English fluency

German advantage

Education

Bachelor’s or Master’s in Electrical Engineering

Materials Science

Physics

Job description

Q.ANT is seeking a Team Lead Co-Packaged Optics to anchor the architecture of our next-generation semiconductor packaging. You will build and scale a new CPO Packaging Team, bridging chip design with external OSAT manufacturing and driving high-volume production readiness.

You’ll own technical direction across photonics and electronics, lead cross-functional collaboration, and implement rigorous DFM and reliability qualification standards to ensure robust, scalable packaging solutions.