HBM SoC RTL Design Intern— AI-Driven Workflows

1000 Micron Technology, Inc.; Folsom (CA); On-site; USD 81,000 - 104,000; Full time

Job summary

Micron Technology invites a SoC Design Engineer Intern to contribute to the design, development, and integration of next-generation HBM logic die. You will work with architecture, verification, physical design, firmware, and product teams to implement robust, high-performance RTL blocks and subsystems.

As part of the Heterogeneous Integration Group, you will participate in SoC-level integration activities, pre- and post-silicon validation, and design reviews while pursuing a BS or MS in

Job description

Micron Technology invites a SoC Design Engineer Intern to contribute to the design, development, and integration of next-generation HBM logic die. You will work with architecture, verification, physical design, firmware, and product teams to implement robust, high-performance RTL blocks and subsystems.

As part of the Heterogeneous Integration Group, you will participate in SoC-level integration activities, pre- and post-silicon validation, and design reviews while pursuing a BS or MS in