HBM Custom Layout Architect — Analog/Mixed‑Signal Lead

Micron Technology, Inc.; Richardson (TX); On-site; USD 150,000 - 190,000; Full time

Job summary

Micron Technology, Inc. is seeking an MTS Design Architect-Custom Layout for HBM in Richardson, Texas. Lead layout for analog, mixed-signal and digital blocks, driving floorplanning, placement, and routing for next‑gen HBM devices.

You will own critical decisions impacting performance, power, and area, collaborate across architecture, circuit build and layout teams, and help advance AI-enabled layout methods to boost efficiency and reliability.

Qualifications

• MS degree with 8+ years memory-related custom layout design, or BS with 12+ years of relevant experience.
• Expertise with Cadence VLE/VXL and Mentor Calibre DRC/LVS.
• Strong analog layout fundamentals: matching, EM, latch‑up, coupling, IR‑drop, crosstalk, parasitics.
• Hands-on experience developing analog and mixed-signal layouts (e.g., sense amps, LDOs, PLLs).
• Experience leveraging AI to accelerate layout development.
• Preferred DRAM custom layout experience.

Responsibilities

• Lead end-to-end layout execution of analog, mixed-signal, and digital blocks for HBM products.
• Own full-chip technical decisions covering analog, digital, memory, EM/IR and PPA.
• Collaborate on floorplanning, placement, routing and integration strategies.
• Support integration of Memory, Logic, and Analog circuits for new HBM architectures.
• Provide design-focused insights to improve circuit robustness and reliability.
• Participate in reviews and fix issues across physical build, parasitics, and full-chip integration.

Skills

Layout design

Cadence VLE/VXL

Analog layout

Mixed-signal design

EM/IR control

AI in layout

Team collaboration

Education

MS in Electrical Engineering

BS in Electrical Engineering

Tools

Cadence

Mentor Graphics Calibre

Parasitic extraction tools

Job description

Micron Technology, Inc. is seeking an MTS Design Architect-Custom Layout for HBM in Richardson, Texas. Lead layout for analog, mixed-signal and digital blocks, driving floorplanning, placement, and routing for next‑gen HBM devices.

You will own critical decisions impacting performance, power, and area, collaborate across architecture, circuit build and layout teams, and help advance AI-enabled layout methods to boost efficiency and reliability.