Hardware Engineer

Odoo; United States; On-site; USD 85,000 - 115,000; Full time

Job summary

Odoo is seeking a skilled hardware engineer to design and test advanced thermal management solutions for datacenter applications in Melbourne on Florida's Space Coast. The role demands a Master's degree in mechanical engineering and requires collaboration within cross-functional teams.

Responsibilities include enhancing product functionalities and implementing innovative solutions for high-performance systems. Experience with liquid cooling systems and thermodynamics is crucial.

Qualifications

• Master's degree required alongside strong skills in thermodynamics.
• Experience in liquid cooling systems at various levels is preferred.
• Familiarity with hardware platforms and integration important.

Responsibilities

• Develop and execute hardware engineering solutions.
• Enhance product functionalities in high-performance datacenters.
• Collaborate with teams to integrate thermal management solutions.

Skills

Thermal management solutions

Thermodynamics and heat transfer

Liquid cooling implementation

Measurement techniques and data processing

Collaboration and communication

Education

Master’s degree in mechanical engineering or related fields

Job description

A successful hardware engineering candidate will be responsible for supporting the design, build and testing of advanced thermal management solutions for hardware platforms in datacenter and telecom installations. We seek a highly skilled engineer to contribute to defining hardware architectures, system implementations, power and thermal. The hardware engineer will report directly to the Chief Technology Officer (CTO). This role will be on‑site and located in Melbourne on Florida’s Space Coast.

Objectives of this Role

• Develop and execute hardware engineering solutions;
• Participate in the qualification and performance improvements of hardware platforms based on customers’ needs;
• Collaborate within cross‑functional teams and build connections within them to realize potential business opportunities;
• Support and execute new development initiatives and programs to favorably position the product portfolio against competitors in the market.

Daily and Monthly Responsibilities

• Play a key role in the hardware engineering team to enhance product functionalities and efficiency for high-performance datacenters and telecommunications equipment, while expanding technology IP;
• Be responsible for the development of thermal management solutions and system integration across multiple length scales;
• Show proven capability to work in matrix mode, meaning strong skillset of collaboration, communication, openness, transparency, willingness to contribute to success.

Skills and Qualifications

• Master’s degree in mechanical engineering or related fields;
• Strong knowledge in thermodynamics, heat and mass transfer, and thermal management solutions for datacenters and telecommunications equipment;
• Experience in liquid cooling implementation at the chip-, server-, rack- and room-levels;
• Experience with measurement techniques, automation, instrument calibrations and validations, as well as data processing;
• Knowledge of hardware platforms and integration, and SoC, CPU and GPU accelerated computing experience.

Preferred Qualifications

• Ph.D. in physics, mechanical engineering or energy engineering;
• Implementation of refrigerant-based two-phase thermal management solutions such as thermosyphons and cold plate technologies;
• Knowledge of mechanical design and micro-fabrication techniques;
• Experience with two-phase heat transfer theory and experiments;
• Ability to scale projects in a fast-paced and innovative environments.