Hardware Engineer

Lancesoft; Town of Texas (WI); Hybrid; USD 96,000 - 124,000; Full time

Job summary

Lancesoft is seeking a detail-oriented Hardware Engineer for a 12-month contract to support hardware development and manufacturing pipelines. The role focuses on evaluating component specifications, ensuring packaging and handling instructions, and maintaining data integrity across PLM systems.

You will work with procurement, QA, engineering, and suppliers to manage ESD, moisture sensitivity, and packaging standards, contributing to risk mitigation and compliance throughout the supply chain.

Qualifications

• Bachelor’s degree in EE, ME, or related field.
• 3–5 years in component engineering, hardware manufacturing, or quality engineering.
• Strong knowledge of electronic packaging (SMD, Through-Hole, BGA, QFN).
• Familiar with IPC/JEDEC and ANSI/ESD S20.20 standards.
• Experience with PLM software and component databases.

Responsibilities

• Review datasheets, drawings, and specs to understand constraints.
• Define packaging methods (tape & reel, trays, tubes) and handling instructions.
• Identify MSL and ESD classifications for protective storage and handling.
• Collaborate with suppliers to resolve packaging and shipping discrepancies.
• Update PLM and AVL with packaging and compliance data.
• Identify obsolete packaging and non-compliant suppliers, propose alternatives.

Skills

Attention to detail

Communication

Packaging knowledge

ESD/Moisture control

PLM software

Datasheet interpretation

Education

Bachelor’s degree in Electrical/Mechanical/Materials Science or related field

Tools

PTC commonPDM

SiliconExpert

IHS Markit

Job description

Job Title: Hardware Engineer

Duration: 12 months

Pay Rate: $78.37/hour

REMOTE OPPORTUNITY

We are seeking a detail-oriented Mid-Level Component Engineer for a contract engagement to support our hardware development and manufacturing pipelines. In this role, you will be primarily responsible for evaluating electronic and mechanical component specifications, identifying compliance requirements, and defining precise packaging and handling (P&H) instructions to ensure component integrity throughout the supply chain. You may collaborate closely with procurement, quality assurance, engineering, and external suppliers to identify risks related to electrostatic discharge (ESD), moisture sensitivity, and physical damage.

Key Responsibilities

• Specification Analysis: Review and analyze component datasheets, engineering drawings, and technical specifications to understand physical, electrical, and environmental constraints.
• Packaging & Handling Definition: Determine and document correct packaging methods (e.G., tape and reel, trays, tubes) and handling instructions based on industry standards and manufacturing requirements.
• Moisture & ESD Management: Identify Moisture Sensitivity Levels (MSL) and Electrostatic Discharge (ESD) classifications to establish appropriate protective storage and handling protocols.
• Supplier Collaboration: Potentially work with logistics, engineering, component manufacturers and distributors to resolve technical discrepancies regarding packaging configurations and shipping standards.
• Database & Documentation Maintenance: Update internal component databases, Product Lifecycle Management (PLM) systems, and Approved Vendor Lists (AVL) with accurate packaging and compliance metadata.
• Risk Mitigation: Identify obsolete packaging types, or non-compliant supplier practices and propose actionable alternatives to engineering and procurement teams.

Qualifications and Skills

Education: Bachelor’s degree in Electrical Engineering, Mechanical Engineering, Materials Science, or a related technical discipline.

Experience: 3 to 5 years of experience in component engineering, hardware manufacturing, or quality engineering.

Technical Knowledge: Deep understanding of electronic component packaging types (SMD, Through-Hole, BGA, QFN) and industry standards such as IPC/JEDEC (e.G., J-STD-020, J STD-033) and ANSI/ESD S20.20.

Software Proficiency: Hands-on experience using PLM software (such as PTC commonPDM) and component database tools (like SiliconExpert or IHS Markit).

Attention to Detail: Proven ability to meticulously interpret complex technical datasheets and mechanical drawings.

Communication: Clear written and verbal communication skills needed to collaborate across cross-functional teams.