Component Engineer

Indotronix Avani Group; McKinney (TX); On-site; USD 80,000 - 110,000; Full time

Job summary

Indotronix Avani Group in the United States is seeking a detail-oriented Mid-Level Component Engineer to support our hardware development and manufacturing pipelines.

You will review datasheets, specify packaging methods (tape and reel, trays, tubes), identify MSL and ESD classifications, and maintain PLM and AVL data while collaborating with suppliers, logistics, and engineering to resolve packaging discrepancies and ensure component integrity throughout the supply chain.

Qualifications

• Bachelor’s degree in Electrical/Mechanical Engineering or related field.
• 3–5 years in component engineering, hardware manufacturing, or quality engineering.
• Deep understanding of packaging types (SMD, Through-Hole, BGA, QFN) and IPC/JEDEC standards (J-STD-020, J-STD-033) and ANSI/ESD S20.20.
• Experience with PLM software and component databases (PTC CommonPDM, SiliconExpert, IHS Markit).
• Strong ability to interpret datasheets and mechanical drawings with exactness.
• Effective communication across cross-functional teams.

Responsibilities

• Specification Analysis: Review datasheets and drawings to understand constraints.
• Packaging & Handling Definition: Document correct packaging methods and handling instructions.
• Moisture & ESD Management: Identify MSL and ESD classifications for protective protocols.
• Supplier Collaboration: Work with logistics, engineering, and distributors to resolve packaging issues.
• Database & Documentation Maintenance: Update PLM systems and AVL with packaging metadata.
• Risk Mitigation: Identify obsolete packaging and propose compliant alternatives.

Skills

Attention to detail

Cross-functional collaboration

Technical datasheet interpretation

Education

Bachelor’s degree in Electrical/Mechanical Engineering or related

Tools

PTC CommonPDM

SiliconExpert

IHS Markit

Job description

• We are seeking a detail-oriented Mid-Level Component Engineer for a contract engagement to support our hardware development and manufacturing pipelines.
• In this role, you will be primarily responsible for evaluating electronic and mechanical component specifications, identifying compliance requirements, and defining precise packaging and handling (P&H) instructions to ensure component integrity throughout the supply chain.

Key Responsibilities:

• Specification Analysis: Review and analyze component datasheets, engineering drawings, and technical specifications to understand physical, electrical, and environmental constraints.
• Packaging & Handling Definition: Determine and document correct packaging methods (e.g., tape and reel, trays, tubes) and handling instructions based on industry standards and manufacturing requirements.
• Moisture & ESD Management: Identify Moisture Sensitivity Levels (MSL) and Electrostatic Discharge (ESD) classifications to establish appropriate protective storage and handling protocols.
• Supplier Collaboration: Potentially work with logistics, engineering, component manufacturers and distributors to resolve technical discrepancies regarding packaging configurations and shipping standards.
• Database & Documentation Maintenance: Update internal component databases, Product Lifecycle Management (PLM) systems, and Approved Vendor Lists (AVL) with accurate packaging and compliance metadata.
• Risk Mitigation: Identify obsolete packaging types, or non-compliant supplier practices and propose actionable alternatives to engineering and procurement teams.

Qualifications and Skills:

• Education: Bachelor’s degree in Electrical Engineering, Mechanical Engineering, Materials Science, or a related technical discipline.
• Experience: 3 to 5 years of experience in component engineering, hardware manufacturing, or quality engineering.
• Technical Knowledge: Deep understanding of electronic component packaging types (SMD, Through-Hole, BGA, QFN) and industry standards such as IPC/JEDEC (e.g., J-STD-020, J-STD-033) and ANSI/ESD S20.20.
• Software Proficiency: Hands-on experience using PLM software (such as PTC commonPDM) and component database tools (like SiliconExpert or IHS Markit).
• Attention to Detail: Proven ability to meticulously interpret complex technical datasheets and mechanical drawings.
• Communication: Clear written and verbal communication skills needed to collaborate across cross-functional teams.