Hands-On Lean Manufacturing Engineer – Microelectronics

Teledyne FLIR; Texas; On-site; USD 80,000 - 110,000; Full time

Benefits offered by this job

Paid time off and holidays

Tuition reimbursement

Retirement savings plans

Job summary

A global technology leader is seeking a Lean Manufacturing Engineer to oversee high-reliability microelectronics manufacturing processes. The successful candidate will have hands-on experience with techniques such as wire bonding and die attach, alongside responsibilities in process optimization and cross-functional collaboration. Ideal applicants should hold an Associate’s degree in engineering and possess 10-15 years of relevant experience. The role offers a competitive compensation package and growth opportunities within the organization.

Qualifications

• 10-15 years of experience in manufacturing or process development.
• Hands‐on experience with microelectronics manufacturing processes.
• Strong communication skills for cross-team coordination.

Responsibilities

• Develop and optimize manufacturing processes from engineering handoff.
• Lead continuous improvement initiatives to enhance yield and reduce scrap.
• Coordinate efforts for new product introductions and engineering changes.

Skills

Microelectronics manufacturing processes (wire bonding, die attach)

Cross-functional communication

Lean Six Sigma

Education

Associate’s degree in engineering

Tools

ERP/MRP systems

Job description

A global technology leader is seeking a Lean Manufacturing Engineer to oversee high-reliability microelectronics manufacturing processes. The successful candidate will have hands-on experience with techniques such as wire bonding and die attach, alongside responsibilities in process optimization and cross-functional collaboration. Ideal applicants should hold an Associate’s degree in engineering and possess 10-15 years of relevant experience. The role offers a competitive compensation package and growth opportunities within the organization.