Global Lead, PCB/PWB Design (RF & High‑Speed)

Qualcomm; San Diego (CA); On-site; USD 171,000 - 256,000; Full time

Job summary

Qualcomm Technologies, Inc. is seeking a senior Lead PWB/PCB Design Director to guide a global design team in San Diego.

The role focuses on delivering high-density PCB layouts, coordinating cross-functional engineering efforts, and driving process improvements for efficiency and quality. You will mentor teams across Mentor Xpedition, PADS, and Cadence Allegro, with emphasis on RF, high-speed digital, and complex stackups.

Qualifications

• 12+ Years of PCB / PWB team management.
• 15+ years actively involved in PCB / PWB design for high-density electronics packaging.
• 15+ years experience in a PCB / PWB design role designing reference designs utilizing latest generation processor chips.
• Design for Manufacture (DFM) analysis experience utilizing Valor and/or CAM350 tools.

Responsibilities

• Lead a world class design team across multiple project disciplines and manage PCB/PWB designs.
• Direct teams to manage complex data and verify accuracy for large projects.
• Lead discussions with stakeholders to align deliverables and milestones.
• Develop new processes and tool automations to maximize efficiencies.
• Mentor CAD design team and drive global process improvements.

Skills

Leadership

Project management

Cross-functional collaboration

Education

Associate's degree in Electrical Engineering, Computer Science, Mathematics, or related field

Bachelor's degree in Electrical Engineering, Computer Science, Mathematics, or related field

Tools

Mentor Xpedition

Mentor PADS

Cadence Allegro

Valor CAM software

Job description

Qualcomm Technologies, Inc. is seeking a senior Lead PWB/PCB Design Director to guide a global design team in San Diego.

The role focuses on delivering high-density PCB layouts, coordinating cross-functional engineering efforts, and driving process improvements for efficiency and quality. You will mentor teams across Mentor Xpedition, PADS, and Cadence Allegro, with emphasis on RF, high-speed digital, and complex stackups.