PCB Designer, Staff

Qualcomm; San Diego (CA); On-site; USD 85,411 - 128,116; Full time

Job summary

Qualcomm Technologies, Inc. in San Diego, CA is seeking an experienced PCB Design Engineer to design high-speed multi-layer PCBs for reference servers and compute systems. You will develop stack-ups, participate in DFM analysis, and ensure manufacturability for high-volume production.

You will collaborate with US teams and partners in India to deliver high-performance PCB solutions, manage design reviews, and communicate status with stakeholders across the project lifecycle.

Qualifications

• 5+ years actively involved in PCB high speed design.
• 5+ years actively involved in PCB design for HDI & high-density electronics packaging.
• 2+ years experience in a PCB design role designing consumer-grade products or low volume test products utilizing latest generation processor chips & ICs.
• Design for Manufacture (DFM) analysis experience utilizing Valor and/or CAM350 tools.

Responsibilities

• Design PCB layouts for reference server and PC compute systems, including form factor accurate (FFA) test platforms and high-volume circuit boards.
• Engineer high-speed, multi-layer stack-ups encompassing application processors, digital processors, RF/radio circuits, and power delivery networks.
• Utilize advanced manufacturing techniques: stacked micro-vias, sequential lamination, and small-pitch package design rules.
• Collaborate effectively with internal teams in the U.S. and design partners in India to deliver high-performance PWB solutions.
• Liaise with internal stakeholders and external vendors to support PCB fabrication and assembly throughout the product lifecycle.

Skills

PCB high-speed design

HDI/high-density packaging

DFM analysis

EMI mitigation techniques

Leadership / project coordination

Communication skills

Tools

Valor

CAM350

IDF/EMN file exchange

Job description

Company

Qualcomm Technologies, Inc.

Job Area

Engineering Services Group, Engineering Services Group > CAD Component

General Summary

Qualcomm is a company of inventors that unlocked 5G & 6G ushering in an age of rapid acceleration in connectivity and new possibilities that will transform industries, create jobs, and enrich lives. But this is just the beginning. It takes inventive minds with diverse skills, backgrounds, and cultures to transform 6G’s potential into world‑changing technologies and products. This is the Invention Age - and this is where you come in.

Key Responsibilities

• Design PCB layouts for reference server and PC compute systems, including form factor accurate (FFA) test platforms and high-volume circuit boards.
• Engineer high-speed, multi-layer stack-ups encompassing application processors, digital processors, RF/radio circuits, and power delivery networks.
• Utilize advanced manufacturing techniques: stacked micro-vias, sequential lamination, and small-pitch package design rules.
• Collaborate effectively with internal teams in the U.S. and design partners in India to deliver high-performance PWB solutions.
• Liaise with internal stakeholders and external vendors to support PCB fabrication and assembly throughout the product lifecycle.

Minimum Qualifications

• 5+ years actively involved in PCB high speed design.
• 5+ years actively involved in PCB design for HDI & high-density electronics packaging.
• 2+ years experience in a PCB design role designing consumer-grade products or low volume test products utilizing latest generation processor chips & ICs.
• Design for Manufacture (DFM) analysis experience utilizing Valor and/or CAM350 tools.

Preferred Qualifications

• Design experience: RF, Analog, High-speed digital circuits – DDR5 & 6, HDMI, PCIe, SATA, MIPI, USB 2,3.x, GigE, LPDDR breakouts, complex stackups.
• Expected to possess expert understanding and demonstrated application of PCB design principles, practices, and standards.
• Able to perform complex and difficult PCB design tasks requiring extensive skill and knowledge of fabrication and assembly process capabilities and limitations.
• Develops solutions to a variety of complex problems and proposes PCB design trade‑offs to the engineering design team for resolution and implementation.
• Determine PCB design trade-offs necessary to meet design requirements and produce high quality cost effective PCB’s that meet schedule objectives.
• Understands the requirements driving PCB technology and process trends and their application to Qualcomm designs.
• Maintain technical coordination with Engineering and Manufacturing. Resolve PCB design issues with fabrication and assembly vendors.
• Participate and provide input into process improvement, PCB and DFM checklists and guidelines.
• Participates in determining objectives of assignment and plans, schedules, and arranges own activities in accomplishing objectives.
• Experience working with various EMI mitigation techniques and practices.
• Experience with IDF/EMN file exchange between mechanical and HW teams.
• Understands project goals and individual contribution toward those goals.
• Effectively communicates with project peers and engineering personnel via e-mail, web meetings, and instant messaging including status reports and illustrative presentation slides.
• Interact and collaborate with HW leads, Engineering team & other internal PCB designers for optimal product development processes and schedule execution.
• Effectively multitasks and meets aggressive schedules in a dynamic environment.
• Prepare and deliver design reviews to project team.
• Possess excellent verbal and written communication skills.
• Leadership skills to help direct, prioritize, and clearly set project tasks per schedule. Communicate milestones and directions to outside team members.

Pay Range & Benefits

$62.04 - $93.06

The above pay scale reflects the broad, minimum to maximum, pay scale for this job code for the location for which it has been posted. Even more importantly, please note that salary is only one component of total compensation at Qualcomm. We also offer a competitive annual discretionary bonus program and opportunity for annual RSU grants (employees on sales‑incentive plans are not eligible for our annual bonus). In addition, our highly competitive benefits package is designed to support your success at work, at home, and at play.

EEO Statement

Qualcomm is an equal opportunity employer; all qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability, Veteran status, or any other protected classification.

Disability Accommodation

Qualcomm is committed to providing an accessible process for individuals with disabilities. Qualified applicants who require accommodations during the application or hiring process may contact the accommodations team.