Foveros Direct Pathfinding Integration at Intel Hillsboro, OR

Sunseeker Property Service; Hillsboro (OR); On-site; USD 142,000 - 269,000; Full time

Benefits offered by this job

Stock bonuses

Health benefits (medical, vision, etc)

Retirement plan

Vacation

Job summary

Intel in Oregon (Hillsboro) is seeking a seasoned packaging engineer to design, develop, and qualify packaging solutions for its products. You will manage the full development cycle, coordinate with manufacturing, regulatory, logistics, and supply chain teams, and drive efficiency and cost improvements.

Candidates will have advanced degrees and extensive experience in semiconductor packaging, testing, and certification.

Qualifications

• Bachelor's degree in engineering, Materials Science, Chemistry, Physics, or related field, and 6+ years of relevant experience.
• Master's degree in engineering, Materials Science, Chemistry, Physics, or a related field, and 4+ years of relevant experience.
• PhD in Engineering, Materials Science, Chemistry, Physics, or a related field, and 4+ years of relevant experience.
• Experience in packaging engineering, process development, and technology innovation.
• Experience in thermal, mechanical, and electrical design concepts related to semiconductor packaging.
• Expertise in qualification testing, specification documentation, and packaging material certification.

Responsibilities

• Apply engineering principles to design, develop, and qualify packaging solutions for products.
• Lead packaging development: artwork, prototypes, testing, specs, and manufacturing coordination.
• Identify opportunities to improve cost, manufacturability, waste, and supply chain.
• Collaborate with product launches, branding, labeling, and BOM requirements for shipments.

Skills

Packaging engineering

Process development

Technology innovation

Thermal design

Mechanical design

Electrical design

Qualification testing

Documentation (specs)

Education

Bachelor's degree in engineering, Materials Science, Chemistry, Physics, or related field

Master's degree in engineering, Materials Science, Chemistry, Physics, or related field

PhD in Engineering, Materials Science, Chemistry, Physics, or related field

Tools

Hybrid Bonding

Job description

Discover how your skills and expertise can have a lasting impact on Intel's industry-leading innovations.

Responsibilities

• You will apply scientific and engineering principles to design, develop, and qualify packaging solutions and materials used to hold, display, dispense, and safely transport all types of products.
• Manage the packaging development process including packaging artwork development, concepts, prototypes, qualification testing, specification documentation, coordination with manufacturing, regulatory, logistics, and supply chain partners, vendor selection and qualification, manufacturing startup, and benchmarking.
• Identifies and implements processes to drive efficiency, cost, manufacturability, waste reduction, sustainability, logistics, and/or packaging supply chain improvement opportunities.
• Consult cross organizational partners on product launch, branding and marketing, SKU, barcodes and labeling, scaling, packaging supply chain, logistics, regulatory and compliance, and bills of material requirements for shipments into Intel's product distribution channel.

Qualifications

• Bachelor's degree in engineering, Materials Science, Chemistry, Physics, or a related field, and 6+ years of relevant experience;
• Master's degree in engineering, Materials Science, Chemistry, Physics, or a related field, and 4+ years of relevant experience;
• PhD in Engineering, Materials Science, Chemistry, Physics, or a related field, and 4+ years of relevant experience.
• Experience in packaging engineering, process development, and technology innovation.
• Experience in thermal, mechanical, and electrical design concepts related to semiconductor packaging.
• Expertise in qualification testing, specification documentation, and packaging material certification.

Preferred Qualifications

• Experience in advanced packaging technology development and strategic supplier management.
• Hybrid Bonding Process development or Integration experience.
• Experience with leading technology programs and engaging with cross-functional stakeholders.
• Experience participating in forums, task forces, or working groups driving defect reduction and process improvements.

Job Type: Experienced Hire

Shift: Shift 1 (United States of America)

Primary Location: US, Oregon, Hillsboro

Additional Locations: US, Arizona, Phoenix

Business group: Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. We ensure our foundry customers' products receive our utmost focus in terms of service, technology enablement and capacity commitments. Employees in the Foundry Technology Manufacturing are part of a worldwide factory network that designs, develops, manufactures, and assembly/test packages the compute devices to improve the lives of every person on Earth.

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Benefits

We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.

Annual Salary Range for jobs which could be performed in the US: $141,910.00-269,100.00 USD

Work Model

This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.*

Additional Information

Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.

Location: US, Oregon, Hillsboro; US, Arizona, Phoenix

Type: Full time