Foundry Operations Leader: Hybrid Bonding & HVM

QUANTUM COMPUTING, INC.

Morrisville (NC)

On-site

USD 260,000 - 420,000

Full time

14 days+
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Job summary

Quantum Computing Inc. in Morrisville, NC seeks a Vice President of Foundry Operations to direct all development, pilot-line, and high-volume manufacturing for a $100M facility with sub-micron hybrid bonding technologies.

The role oversees 100+ on-site personnel, bridging R&D scaling to full production on a 24/7 manufacturing line. Ideal candidates bring 10+ years in advanced semiconductor manufacturing, 5+ years leading fab lines, and deep experience with hybrid bonding, TSV, CMP, and

Qualifications

  • 10+ years in advanced semiconductor manufacturing or packaging
  • 5+ years managing a fab line bridging pilot development and high-volume manufacturing
  • Experience leading 24/7 high-mix/low-volume R&D to HVM transitions
  • Strong budget, CapEx, and line-balancing experience

Responsibilities

  • Own operating budget, CapEx, and line-balancing for a hybrid facility
  • Drive operational excellence and yield optimization across sub-micron processes
  • Supervise intake, handling, and processing variations for diverse substrates (Si, Glass, Compound Semiconductors)
  • Oversee complex process flow (BEoL, TSV insertion, wafer thinning, interposers)
  • Lead and mentor a 100+ person cross-functional team of cleanroom operators and engineers
  • Enforce surface-prep and contamination-control protocols for high reliability

Skills

Semiconductor manufacturing
Leadership
Hybrid bonding
P&L management
Fab operations

Education

Bachelor’s in Materials Science/Engineering
Master’s or Ph.D. in a relevant field

Tools

Hybrid bonding
D2W/W2W bonding
CMP

Job description

Quantum Computing Inc. in Morrisville, NC seeks a Vice President of Foundry Operations to direct all development, pilot-line, and high-volume manufacturing for a $100M facility with sub-micron hybrid bonding technologies.

The role oversees 100+ on-site personnel, bridging R&D scaling to full production on a 24/7 manufacturing line. Ideal candidates bring 10+ years in advanced semiconductor manufacturing, 5+ years leading fab lines, and deep experience with hybrid bonding, TSV, CMP, and

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