Vice President of Foundry Operations

QUANTUM COMPUTING, INC.; Morrisville (NC); On-site; USD 260,000 - 420,000; Full time

Job summary

Quantum Computing Inc. in Morrisville, NC seeks a Vice President of Foundry Operations to direct all development, pilot-line, and high-volume manufacturing for a $100M facility with sub-micron hybrid bonding technologies.

The role oversees 100+ on-site personnel, bridging R&D scaling to full production on a 24/7 manufacturing line. Ideal candidates bring 10+ years in advanced semiconductor manufacturing, 5+ years leading fab lines, and deep experience with hybrid bonding, TSV, CMP, and

Qualifications

• 10+ years in advanced semiconductor manufacturing or packaging
• 5+ years managing a fab line bridging pilot development and high-volume manufacturing
• Experience leading 24/7 high-mix/low-volume R&D to HVM transitions
• Strong budget, CapEx, and line-balancing experience

Responsibilities

• Own operating budget, CapEx, and line-balancing for a hybrid facility
• Drive operational excellence and yield optimization across sub-micron processes
• Supervise intake, handling, and processing variations for diverse substrates (Si, Glass, Compound Semiconductors)
• Oversee complex process flow (BEoL, TSV insertion, wafer thinning, interposers)
• Lead and mentor a 100+ person cross-functional team of cleanroom operators and engineers
• Enforce surface-prep and contamination-control protocols for high reliability

Skills

Semiconductor manufacturing

Leadership

Hybrid bonding

P&L management

Fab operations

Education

Bachelor’s in Materials Science/Engineering

Master’s or Ph.D. in a relevant field

Tools

Hybrid bonding

D2W/W2W bonding

CMP

Job description

Job Title : Vice President of Foundry Operations

Location : Morrisville, NC

Division: Nhanced

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About Us:

Quantum Computing Inc. (QCi) (Nasdaq: QUBT) is an innovative, integrated photonics company that provides accessible and affordable quantum machines to the world today. QCi products are designed to operate at room temperature and low power at an affordable cost. The Company’s portfolio of core technology and products offer unique capabilities in the areas of high-performance computing, artificial intelligence, cyber security as well as remote sensing applications.

Scope of the Job:

This position directs all development, pilot-line, and high-volume manufacturing (HVM) operations for a $100M production scale facility utilizing sub-micron hybrid bonding tech and supporting > 100 on-site employees. This unique leadership role bridges low-volume R&D scaling for multi-size, multi-substrate architectures with the operational rigor of a 24/7 high-volume 300mm manufacturing line.

Duties / Responsibilities:

• P &L & Dual-Mode Operations: Own the operating budget, CapEx, and line-balancing for a hybrid facility that simultaneously handles high-mix/low-volume R&D (50mm–200mm) and high-volume 300mm production.
• Hybrid Bonding Execution: Drive operational excellence and yield optimization across sub-micron particle-sensitive processes, specifically Die-to-Wafer (D2W) and Wafer-to-Wafer (W2W) hybrid bonding.
• Multi-Substrate Engineering Control: Supervise the intake, handling, and custom processing variations for a wide variety of substrate materials (e.g., Silicon, Glass, Compound Semiconductors).
• Advanced Process Management: Oversee a complex process flow including Custom BEoL (Back-End-of-Line), TSV (Through-Silicon Via) insertion and reveal, precision wafer thinning, and silicon/glass interposer fabrication.
• Team Leadership & Scale: Lead, mentor, and align a 100+ person multi-disciplinary team comprising cleanroom operators, equipment technicians, pilot-line development engineers, and HVM production supervisors.
• Yield & Cleanroom Discipline: Enforce strict surface-preparation and contamination-control protocols required for successful hybrid bonding, ensuring high reliability and SPC compliance.

Required Skills & Experience:

• Education: Bachelor’s degree in Materials Science, Chemical, Mechanical, or Electrical Engineering; Master’s or Ph.D. with a focus on advanced semiconductor packaging is highly preferred.
• Experience: Minimum 10 years in advanced semiconductor manufacturing or packaging, with at least 5 years of experience managing a fab line that bridges pilot development and high-volume manufacturing.
• Technical Expertise: Direct operational exposure to hybrid bonding, TSV reveal, CMP (Chemical Mechanical Planarization) for surface flatness, precision wafer thinning/carrier bonding, and multi-size wafer handling (50mm to 300mm).
• Operational Capabilities: Demonstrated ability to manage rapid product-mix changes on development lines while maintaining uptime, OTD (On-Time Delivery), and cycle-time discipline on an HVM line.

Quantum Computing Inc. (QCi) is an Equal Opportunity Employer.

All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, age, disability, protected veteran status, or any other characteristic protected by applicable federal, state, or local law.

Incumbent(s) in this position may be required to perform other duties and special assignments not specifically stated above.

Statements outlined in this section are designated as essential job functions in accordance with the Americans with Disabilities Act of 1990.