Field Process Engineering Lead, NPI & HVM

ASM; Fields (OR); On-site; USD 150,000 - 220,000; Full time

Job summary

ASM is seeking a Manager II, Field Process to lead customer engagements, drive NPI and ensure a smooth transition to high-volume manufacturing. You will build and mentor a high-performing field process team while partnering with R&D, product engineering, and sales to align program objectives and timelines.

The role requires deep expertise in thin-film processes (PEALD, PECVD, LPCVD, ALD, epitaxy) and a proven track record in managing complex deposition transfers from R&D to HVM.

Qualifications

• PhD or Master's in physics, chemistry, materials science or related engineering field.
• 12+ years with a Bachelor's, 9+ years with a Master's, or 6+ years with a PhD in the semiconductor industry with thin-film process expertise.
• Experience leading NPI, HVM programs, and transferring complex deposition processes from R&D to manufacturing.
• Strong project management, analytical and problem-solving skills.
• Proven leadership with track record of organizational change.
• Willingness to travel; primary customer onsite in Boise, Idaho.

Responsibilities

• Lead customer process engagement and serve as a trusted technical advisor.
• Drive NPI programs through qualification and HVM adoption, ensuring on-time milestones.
• Partner with R&D, Product Engineering, and Sales to execute technology programs and roadmaps.
• Recruit, mentor, and develop a high-performing field-process team.
• Manage escalations and maintain clear communication across customers and teams.

Skills

Customer leadership

Technical leadership

Cross-functional collaboration

Project management

Problem solving

Escalation management

Travel readiness

Education

PhD or Master’s in Physics/Engineering/Materials Science

Job description

ASM is seeking a Manager II, Field Process to lead customer engagements, drive NPI and ensure a smooth transition to high-volume manufacturing. You will build and mentor a high-performing field process team while partnering with R&D, product engineering, and sales to align program objectives and timelines.

The role requires deep expertise in thin-film processes (PEALD, PECVD, LPCVD, ALD, epitaxy) and a proven track record in managing complex deposition transfers from R&D to HVM.