Field Applications Engineering Intern — Embedded Systems

NXP Semiconductors NV; Novi (MI); On-site; USD 25,000 - 44,000; Full time

Benefits offered by this job

Housing stipend

Relocation assistance

Return full-time offer consideration

Job summary

NXP Semiconductors NV is seeking a technically curious engineering student for a 12-week Field Applications Engineering Intern program in the United States. Interns are embedded with FAEs, paired with a mentor, and work on customer-facing projects that translate requirements into NXP‑based solutions.

The internship focuses on embedded systems, lab validation, and design‑in activities, with exposure to real customer scenarios and potential offers for full‑time TSAP roles after graduation.

Qualifications

• Currently pursuing a Bachelor's or Master's degree in a technical field (EE, CE, CS, Mechatronics) with strong academic standing.
• Rising junior, senior, or graduate student — graduation between Dec 2027 and Jun 2029.
• Cumulative GPA of 3.0/4.0 or higher.
• Authorization to work in the United States (no sponsorship for intern roles).
• Availability for 12 weeks full-time Summer 2027 (May–August).

Responsibilities

• Assist FAEs on customer-facing technical projects with real business impact.
• Translate customer requirements into practical NXP-based solutions and support evaluations/POCs.
• Develop hands-on experience with embedded systems, lab validation, and design-in activity.
• Prepare customer-ready technical presentations and training material.

Skills

C

C++

Python

Embedded systems

Education

Bachelors or Masters in Electrical Engineering / Computer Engineering / Computer Science / Mechatronics

Tools

Microcontrollers

MPUs

FPGAs

Development boards

Reference designs

ARM-based systems

Job description

NXP Semiconductors NV is seeking a technically curious engineering student for a 12-week Field Applications Engineering Intern program in the United States. Interns are embedded with FAEs, paired with a mentor, and work on customer-facing projects that translate requirements into NXP‑based solutions.

The internship focuses on embedded systems, lab validation, and design‑in activities, with exposure to real customer scenarios and potential offers for full‑time TSAP roles after graduation.