Failure Analysis Engineer

Wistron InfoComm Technology (USA) Corporation; Texas; On-site; USD 90,000 - 130,000; Full time

Job summary

The Failure Analysis Engineer at Wistron InfoComm Technology (USA) Corporation investigates failures in electronic assemblies and server hardware used in AI-related products, performing root-cause analysis to improve reliability and yields.

You will collaborate with R&D, manufacturing, quality, supplier quality, and customer support to implement CAPA and drive product/process improvements while ensuring compliance with ESD, ISO, RoHS, and REACH, and maintaining equipment readiness.

Qualifications

• Bachelor’s degree required in EE, Materials Science, ME, or related field.
• 3–5 years of failure analysis or reliability engineering in electronics or high-tech manufacturing.
• Experience with AI server systems, GPU boards, or data center hardware is a plus.

Responsibilities

• Conduct Failure Analysis and Root Cause Investigations on defective products from manufacturing, field returns (RMA), and reliability testing.
• Utilize Advanced Analytical Tools and Techniques, including oscilloscopes, X-ray, SEM/EDS, decapsulation, and cross-section analysis, to diagnose failures.
• Prepare Technical Reports and Reliability Metrics documenting findings, corrective actions, risk assessments, failure trends, and MTBF.
• Analyze Failure Trends and Drive Corrective Actions by identifying recurring issues and recommending preventive measures.
• Collaborate Cross-Functionally with R&D, manufacturing, quality, supplier quality, and customer support teams to implement CAPA.
• Support Product and Process Improvement Initiatives through DFM/DfR reviews, design validation, and process optimization.
• Ensure Compliance, Laboratory Safety, and Equipment Readiness by adhering to ESD, ISO, RoHS, and REACH requirements.

Skills

Root cause analysis

Data-driven analysis

Cross-functional collaboration

Reliability engineering

Education

Bachelor’s degree in Electrical Engineering

Tools

Oscilloscopes

X-ray

SEM/EDS

Cross-section analysis

Job description

The Failure Analysis Engineer (FAE) is responsible for investigating, analyzing, and identifying root causes of failures in electronic assemblies, systems, and components used in high-performance computing, server, and AI related hardware products. This role supports continuous improvement and product reliability initiatives through data-driven analysis, cross-functional collaboration, and corrective action implementation. The FAE will leverage advanced diagnostic tools and methods to enhance product quality, manufacturing yields, and customer satisfaction

Key Responsibilities :

• Conduct Failure Analysis and Root Cause Investigations on defective products from manufacturing, field returns (RMA), and reliability testing to identify failure mechanisms and root causes.
• Utilize Advanced Analytical Tools and Techniques, including oscilloscopes, X-ray, SEM/EDS, decapsulation, and cross-section analysis, to diagnose electrical, mechanical, and thermal failures.
• Prepare Technical Reports and Reliability Metrics, documenting findings, corrective actions, risk assessments, failure trends, and reliability performance indicators such as MTBF.
• Analyze Failure Trends and Drive Corrective Actions by identifying recurring issues and recommending preventive measures to improve product quality and reliability.
• Collaborate Cross-Functionally with R&D, manufacturing, quality, supplier quality, and customer support teams to implement CAPA and resolve product-related issues.
• Support Product and Process Improvement Initiatives through DFM/DfR reviews, design validation, and process optimization to reduce defects and enhance product robustness.
• Ensure Compliance, Laboratory Safety, and Equipment Readiness by adhering to ESD, ISO, RoHS, and REACH requirements while maintaining equipment calibration and operational standards.

Qualifications

Education:

• Bachelor’s degree in Electrical Engineering, Materials Science, Mechanical Engineering, or related field required.

Experience:

• 3–5 years of experience in failure analysis or reliability engineering within electronics, semiconductor, or high-tech manufacturing industries.
• Experience with AI server systems, GPU boards, or data center hardware is a plus.