Failure Analysis Engineer(A Group MLB._.FAE)-Houston,TX

鴻海精密工業股份有限公司; Houston (TX); On-site; USD 70,000 - 90,000; Full time

Job summary

A leading electronics manufacturer in Houston is seeking a Failure Analysis Engineer to lead investigations on defects and optimize processes. The successful candidate will analyze production yields, diagnose failures, and provide insights for improvements. A Bachelor's degree in Electronic information engineering and relevant experience in the electronics sector are required. Ideal candidates will possess strong analytical skills and proficiency with diagnostics tools, as well as communicate effectively both in English and preferably in Mandarin.

Qualifications

• Bachelor's degree in Electronic information engineering required.
• 1-3 years of work experience in failure analysis in electronics sectors.

Responsibilities

• Track production yield and analyze trends to flag anomalies.
• Diagnose defects using advanced tools to identify root causes.
• Lead Root Cause Analysis and implement preventive actions.
• Deliver yield reports and present findings to stakeholders.
• Identify risks and recommend process improvements.

Skills

Circuit architecture

Testing principles

Chip functionality

Component specifications

Circuit design principles

Diagnostics instrumentation

Analytical problem-solving

Clear communication skills

Proficient in English

Working knowledge of Mandarin

Proficient in Spanish

Education

Bachelor's degree in Electronic information engineering

Master's degree

Tools

Oscilloscopes

Spectrum analyzers

Multimeters

Job description

Purpose of the position

Foxconn Technology Group, a global leader in electronics manufacturing, is seeking a Failure Analysis Engineer to lead root cause investigations and drive process optimization. Once a part of the team you will have opportunity to lead real‑time yield monitoring and rapid anomaly resolution to maintain target performance; drive dynamic analysis of defective main logic board to build troubleshooting expertise and streamline diagnostics; compile and deliver product analysis and yield reports to inform decision‑making.

Duties and Responsibilities

• Track production yield in real time, analyze trends weekly/monthly, and flag critical anomalies for leadership review.
• Diagnose main logic board defects using advanced tools (oscilloscopes, spectrum analyzers, etc.) to identify root causes.
• Respond immediately to yield deviations, lead Root Cause Analysis, and implement Corrective & Preventive Actions to resolve issues.
• Adhere to company policies and Standard Operating Procedures for quality inspections to ensure consistent, standards‑based processes.
• Deliver weekly yield reports and present monthly trends/anomalies to stakeholders for strategic decision‑making.
• Identify process risks through continuous yield monitoring and recommend improvements to strengthen quality outcomes.

Education and work experience

• Successful completion of 4‑years of high school, or equivalent, plus completion of 4 years of college with a bachelor’s degree, plus attainment of a master’s degree. Degree required: Electronic information engineering
• 1‑3 years of work experience in failure analysis within Computer, Communication, and Consumer Electronics sectors

Working conditions

• Modern, collaborative offices or labs with flexible setups emphasizing innovation and teamwork.
• Employees are continuously encouraged to learn and grow their careers in smart manufacturing.

Skills

• Proficiency in circuit architecture, testing principles, chip functionality, component specifications, and circuit design principles.
• Proficient with diagnostics instrumentation (oscilloscopes, multimeters, spectrum analyzers) to troubleshoot hardware issues and analyze faults.
• Analytical problem‑solving and clear communication skills to craft technical reports and deliver actionable insights to teams and clients.
• Proficient in English; working knowledge of Mandarin is preferred but not required. Proficiency in Spanish is a plus.