Failure Analysis Engineer

ao-inc

Sugar Land (TX)

On-site

USD 80,000 - 100,000

Full time

14 days+

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Benefits offered by this job

Flexible health (medical, dental, vision) plans
Employer matching on 401(k)
Generous PTO policy
Relocation package
Immigration sponsorships

Job summary

ao-inc is seeking a Failure Analysis Engineer for their process integration team based in Sugar Land, Texas. The role involves performing failure analysis on semiconductor optical laser devices and collaborating with various teams to develop improvement plans.

Ideal candidates will have hands-on experience with Transmission Electron Microscopy (TEM) and Focused Ion Beam (FIB), as well as strong data analysis and problem-solving skills. A Master’s degree or Ph.D. in a relevant field is preferred, with 1 year of related experience.

Qualifications

  • Typically 1–3+ years of hands-on experience in a lab or manufacturing.
  • Ability to work independently and as a team.
  • Excellent interpersonal and communication skills.

Responsibilities

  • Perform internal failure analysis and microscopic inspection.
  • Utilize Focused Ion Beam (FIB) for sample preparation.
  • Analyze structural and electrical defects in semiconductor devices.
  • Document findings in detailed technical reports.
  • Ensure high uptime of TEM/FIB equipment.

Skills

Hands-on experience with Transmission Electron Microscopy (TEM)
Experience with Focused Ion Beam (FIB)
Data analysis
Problem-solving skills
Knowledge of compound semiconductor device theory
Microsoft Access
SQL
LabVIEW

Education

Master’s degree or Ph.D in Material Science Engineering, Electrical Engineering, Physics

Tools

Energy Dispersive X-ray Spectroscopy (EDX/EDS)
Statistical Process Control (SPC)

Job description

Summary

A failure analysis engineer for the process integration team will be responsible for failure analysis of semiconductor optical laser devices. He/She should have experience with front-end and back-end-of-line, and packaging processing. Good understanding of reliability evaluation techniques and understanding failure analysis experience is desirable. He/she will collaborate with other individuals and functional teams, define projects, address issues, develop improvement plans, and finally document and deliver the desired end results.

Job Duties
  1. Responsible for internal failure analysis including device decap, internal microscopic and SEM inspection, internal measurement data analysis.
  2. Hands-on experiences on sample Preparation & Imaging: Utilize Focused Ion Beam (FIB) to prepare TEM samples and perform high-resolution imaging (HR-STEM) to identify defects at the atomic level.
  3. Root Cause Analysis: Analyze structural, electrical, and physical defects in semiconductor devices, identifying issues related to yield, reliability, or process.
  4. Material Characterization: Apply Energy Dispersive X-ray Spectroscopy (EDX/EDS) and other analytical techniques (SIMS, XPS, SEM) to characterize materials.
  5. Reporting & Collaboration: Document findings in detailed technical reports, present data to cross-functional teams (design, process, QA), and support continuous improvement initiatives.
  6. Equipment Maintenance: Ensure high uptime of TEM/FIB equipment through routine calibration and troubleshooting.
Qualifications
  1. Hands-on experience with Transmission Electron Microscopy (TEM) and FIB in a lab or manufacturing environment (typically 1–3+ years).
  2. Master’s degree or Ph.D in Material Science Engineering, Electrical Engineering, Physics, or related discipline plus 1 year of working experience in semiconductor laboratory or fabrication is preferred.
  3. Knowledge of compound semiconductor device theory is desired.
  4. Microsoft Access, SQL, LabVIEW and other programming skills preferred.
  5. Experience with DOE techniques and SPC (Statistical Process Control) is preferred.
  6. Strong data analysis and problem solving skills.
  7. Detail oriented and self‑motivated.
  8. Ability to work independently and as a team.
  9. Ability to work in clean room environment wearing smock.
  10. Excellent interpersonal and communication skills for successful inter and intra-group interactions.
Physical Demands and Work Environment
  1. Subject to noise, vibration, dust, odors, and exposure to toxic or caustic chemicals.
  2. The associate works in a manufacturing environment and is required to wear personal protective equipment.
Location

This position will be on‑site based in Sugar Land, Texas.

Benefits
  • Flexible and competitive health (medical, dental, vision) plans offer the employee with the right options to meet individual and family needs.
  • Employer matching on 401(k) deferrals.
  • Generous PTO policy, with unused PTO payout at end of the year.
  • Relocation package available within the US.
  • Immigration sponsorships (Must be currently authorized to work in the US).
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