Failure Analysis Engineer

Foxconn Industrial Internet - FII; North Carolina; On-site; USD 90,000 - 130,000; Full time

Job summary

Foxconn Industrial Internet - FII in the United States is seeking a highly skilled Failure Analysis Engineer (FAE) to join our team. The role focuses on identifying failure symptoms, conducting in-depth circuit analysis, and determining root causes to drive corrective actions that improve product quality and customer satisfaction.

You will work closely with Foxconn R&D, Product Engineering, and Quality Engineering, and collaborate with customers to ensure deliverables stay within scope and

Qualifications

• Bachelor’s degree or higher in Electrical Engineering, Microelectronics, Physics, or related field.
• Minimum of seven (7) years of experience in FA, with hands-on HW fault isolation experience.
• Proven ability to debug complex hardware using test equipment.
• Knowledge of server architectures and peripherals.
• Experience with EDA tools and layout editing software.
• Ability to work with cross-functional teams and customers.

Responsibilities

• Troubleshoots and identifies root causes for hardware failures across multiple system levels.
• Lead engineering investigations of escalations to resolution.
• Collaborate with design, manufacturing, and other disciplines to resolve issues.
• Support RMA and service centers with best practices.
• Promote operational excellence and process improvements.
• Perform additional duties as required.

Skills

Engineering Knowledge

RMA/Service

Clear Communication

Analytical Skills

Linux Knowledge

Debugging Tools

Semiconductor Physics

EDA Tools

Circuit Troubleshooting

Education

Bachelor’s degree or higher in Electrical Engineering, Microelectronics, Physics, or related field

Tools

Logic Analyzers

Oscilloscopes

IPMI Tools

SEM

Job description

Overview

We are seeking a highly skilled and motivated Failure Analysis Engineer (FAE) to join our team. The successful candidate will work directly with clients to ensure deliverables fall within the applicable scope and budget. We are seeking a highly skilled and motivated Senior Engineering Team Member to support the resolution of hardware issues related to our ESSN Server Products portfolio. The role involves close collaboration with customers, as well as internal teams including Foxconn R&D, Product Engineering, and Quality Engineering. This position focuses on identifying elevated factory and field failure symptoms, conducting in-depth circuit failure analysis, and determining root causes, leading to corrective actions that improve product quality and customer satisfaction.

Duties and Responsibilities

• Troubleshoots, debugs, and determines root cause at multiple system levels for customer devices.
• Analyzes circuits and topologies to identify marginal failure root causes.
• Drives recovery actions and repairs for failing devices.
• Engineering Investigations: Lead engineering investigations of significant customer field and factory escalations related to hardware issues, ensuring timely resolution.
• Customer Satisfaction & Quality Improvement: Enhance customer satisfaction and product quality by addressing hardware-related issues promptly and efficiently.
• Cross-functional Collaboration: Work directly with design and manufacturing teams to investigate hardware issues down to the component level.
• Internal Collaboration: Collaborate with multiple internal engineering disciplines (HW, SW, Diags, Quality, Product, Mechanical, Materials, Reliability) to resolve complex hardware issues.
• Capture Programs Support: Facilitate the execution of special capture programs such as Early Field Capture, Selective Field Capture, ORT, L6, L10, L11 Factory Operations, and RMA.
• Feedback & Process Improvement: Provide feedback to internal and external teams based on analytical findings to improve process and design methodologies.
• RMA & Service Support: Assist in communicating best practices for WW RMA & Service Centers to improve product knowledge and streamline operations.
• Operational Excellence: Promote “best practices” across WW Operational, RMA, and Service Sites, driving efficiencies and quality improvements.
• Miscellaneous Duties: Perform additional duties as required, based on business needs

Skill/Knowledge Requirements:

• Engineering Knowledge: Deep understanding of Industry Standard Servers & Storage architecture and peripherals.
• RMA & Service Manufacturing Expertise: Familiarity with PCA, system, and RMA & service manufacturing environments.
• Clear Communication: Strong verbal and written communication skills, with the ability to convey complex ideas effectively.
• Analytical Problem-Solving: Ability to isolate and resolve hardware failures, including safely injecting failures during debugging to pinpoint root causes.
• Linux Knowledge : Working knowledge of Linux commands and structures, including exposure to SEL and IPMI tools.
• Debugging Tools & Algorithm Development: Proficient in developing and debugging algorithms, creating test tools to assist with failure isolation, and documenting findings for team sharing.
• Strong understanding of semiconductor device physics, IC design, and fabrication processes.
• Experience with EDA (Electronic Design Automation) tools and layout editing software.
• Strong problem-solving skills with the ability to diagnose and resolve complex circuit issues.

Education and Experience:

• Bachelor’s degree or higher in Electrical Engineering, Microelectronics, Physics, or a related field (or equivalent experience).
• Minimum of seven (7) years of experience in FA, at best with hands-on experience in technique enablement and development of supporting HW for Fault-Isolation and/or vacuum-based microscopic systems (e.g., SEM, DMM).
• Technical Skills: Proven ability to debug complex hardware issues using logic analyzers, oscilloscopes, and other test equipment.
• Server Technology Knowledge: Familiarity with key server technologies such as x86 & ARM multi-core processors, DDR4/5, NAND memory, PCI-e protocols, SAS, SCSI, SATA, FibreChannel, Ethernet, WiFi, Bluetooth, NVMe, and SSD technologies.
• Self-Motivation: Must be a self-driven team player, able to perform in a fast-paced, customer-focused environment with minimal supervision.
• Development Lifecycle: Familiarity with the full hardware/software development lifecycle, and hardware/firmware/software development and testing methodologies.
• Collaboration: Proven experience working with internal and external partners.
• Knowledge of failure analysis techniques and methodologies.

Additional Requirements Experience:

• Physical Requirements:Ability to perform various physical tasks such as walking, standing, bending, and lifting to 20 lbs. Must also be able to perceive depth, operate motor vehicles, and use equipment related to the job.
• Work Conditions:The role may require working in environments with machines, electrical energy, and other potentially hazardous conditions. Candidates should be flexible regarding irregular hours and travel by various means of transportation (car, van, bus, and airplane).
• Tools & Equipment:Must be comfortable working with computers, related equipment, typewriters, calculators, copiers, fax machines, telephones, and automobiles as part of daily responsibilities .