Fab Process Engineering Lead, Raxium

Raxium; Fremont (CA); On-site; USD 190,000 - 240,000; Full time

Job summary

Raxium in Fremont, CA is seeking a senior semiconductor process engineer with a strong background in patterning, lithography, wafer bonding, CMP and plasma processing. The candidate should have a Master's degree in a related field and at least 10 years of experience in wafer fab environments.

Preferred qualifications include a Ph.D., Six Sigma Black Belt, 15 years in high-volume fabrication, and experience in device fabrication and process integration of optoelectronics.

Qualifications

• Master's degree or equivalent practical experience in EE, physics, materials science, chemistry, or related field.
• 10 years of experience in semiconductor process engineering in wafer fab manufacturing.
• 7 years of technical leadership experience.

Responsibilities

• Fab technical leadership and cross-functional engineering governance.
• Experience in device fabrication and process integration of semiconductor optoelectronics devices.
• Define process robustness strategy, manage executive communication with senior stakeholders.

Skills

Structured problem-solving

Data analysis

Technical leadership

Cross-functional collaboration

Executive communication

Education

Master's degree in Electrical Engineering, Physics, Materials Science, Chemistry or related field

Ph.D in Electrical Engineering, Physics, Materials Science, Chemistry or related field

Job description

• Master's degree in Electrical Engineering, Physics, Materials Science, Chemistry or a related field or equivalent practical experience.
• 10 years of experience in semiconductor process engineering in semiconductor wafer fab manufacturing (e.g., patterning and lithography, wafer bonding and CMP, wet chemical processes, plasma processing, etc.).
• 7 years of technical leadership experience.

Minimum Qualifications

• Master's degree in Electrical Engineering, Physics, Materials Science, Chemistry or a related field or equivalent practical experience.
• 10 years of experience in semiconductor process engineering in semiconductor wafer fab manufacturing (e.g., patterning and lithography, wafer bonding and CMP, wet chemical processes, plasma processing, etc.).
• 7 years of technical leadership experience.

Preferred Qualifications

• Ph.D in Electrical Engineering, Physics, Materials Science, Chemistry or a related or field equivalent practical experience.
• Black belt of six sigma practitioner.
• 15 years of experience in semiconductor process engineering in high-volume semiconductor wafer fab manufacturing.
• Experience in device fabrication and process integration of semiconductor optoelectronics devices.
• Fab technical leadership experience defining the process robustness strategy and execution, managing engineering cross-functions, influencing senior stakeholders, and managing executive communication.
• Expertise in structured problem-solving, data query and analysis.