Fab Process Engineering Lead, Raxium

Socket.dev; Fremont (CA); On-site; USD 236,000 - 329,000; Full time

Job summary

Google's Raxium Fab is seeking a Fab Process Engineering Lead in Silicon Valley to guide the development and manufacturing of GaN-on-Si micro LED devices. You will define priorities, develop and manage performance, and build a high-performing engineering team, driving reliable, scalable fabrication.

You will own select process areas, oversee process innovation, tool installations, and capability improvements, and collaborate with cross-functional partners to align with safety, quality, and

Qualifications

• Master's degree or equivalent practical experience in a related field.
• 10 years of semiconductor process engineering experience in wafer fabrication.
• 7 years of technical leadership experience.

Responsibilities

• Own select process engineering areas from proof-of-concept to manufacturing.
• Drive the wafer fab roadmap and KPIs through process innovation and new tool installations.
• Utilize SPC, FMEA and RCA to eliminate bottlenecks and improve lithography/etch stability.
• Act as the primary technical liaison for fab operations, ensuring safety and quality.
• Cultivate an engaged engineering team through performance management and development.

Skills

Structured problem-solving

Data query and analysis

Technical leadership

Process engineering

Statistical process control

Cross-functional collaboration

Education

Master's degree in Electrical Engineering, Physics, Materials Science, Chemistry or related field

Ph.D in Electrical Engineering, Physics, Materials Science, Chemistry or related field

Tools

Six Sigma Black Belt

Job description

Minimum qualifications:

• Master's degree in Electrical Engineering, Physics, Materials Science, Chemistry or a related field or equivalent practical experience.


• 10 years of experience in semiconductor process engineering in semiconductor wafer fab manufacturing (e.g., patterning and lithography, wafer bonding and CMP, wet chemical processes, plasma processing, etc.).


• 7 years of technical leadership experience.

Preferred qualifications:

• Ph.D in Electrical Engineering, Physics, Materials Science, Chemistry or a related or field equivalent practical experience.


• Black belt of six sigma practitioner.


• 15 years of experience in semiconductor process engineering in high-volume semiconductor wafer fab manufacturing.


• Experience in device fabrication and process integration of semiconductor optoelectronics devices.


• Fab technical leadership experience defining the process robustness strategy and execution, managing engineering cross-functions, influencing senior stakeholders, and managing executive communication.


• Expertise in structured problem-solving, data query and analysis.

About the job:

As a Fab Process Engineering Lead, you will be joining our talented team in Silicon Valley. Raxium's technology is based on GaN-on-Si micro LEDs, with more demanding process requirements than found in typical LED fabs, with an installed equipment set to meet those needs.

You will select, motivate, set priorities, develop and manage the individual performance to ensure functional excellence and engaged team members. You'll contribute to the innovation behind products loved by billions worldwide and be a part of a team as we develop a truly novel display technology.

Google's Raxium display group has established a revolutionary semiconductor materials display technology that enables new functionality in display products, bringing to users a closer and more natural linkage between the digital and physical realms in applications such as augmented reality (AR) and light-field display. With start-up roots and a state-of-the-art compound semiconductor fab in Silicon Valley, Raxium is seeking to build upon its engineering team with an aim to disrupt next-generation display markets.

Individual pay is determined by factors including job-related skills, experience, and relevant education or training.

US: $236000 - $329000 (USD) + 25% bonus target + equity + benefits

Learn more about benefits at Google.

Responsibilities:

• Own select process engineering areas, ensuring seamless transitions from proof-of-concept to manufacturing, which is now underway. Specific module responsibilities will be dependent on your experience and skillset.


• Drive the strategic wafer fab roadmap and deliver key performance indicators (KPIs) by overseeing process innovation, new tool installations and process capability enhancements. Implement equipment and process optimization to maximize production efficiencies and optimize wafer output.


• Utilize statistical process control (SPC), failure mode and effect analysis (FMEA) and structured problem-solving (RCA) to eliminate systemic bottlenecks and enhance lithography and etch module stability.


• Act as the primary technical liaison for fab operations, ensuring all safety, quality, and manufacturability standards are surpassed.


• Cultivate an engaged, engineering team through proactive performance management and talent development.