EUV Thin‑Film Process Engineer for Next‑Gen DRAM
micron
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Job summary
Micron Technology in New York is seeking a Thin Films Engineer to develop and transfer deposition processes that enable EUV-enabled DRAM. You will own thin film concepts from early development through high-volume manufacturing and partner with multidisciplinary teams to deliver robust, scalable solutions.
The role requires a PhD or MS with several years in semiconductor materials or process development, with hands-on experience in ALD/CVD processes and patterning films.
Qualifications
- PhD or MS with 4+ years semiconductor experience in materials or process development.
- Strong foundation in materials science, chemical reaction engineering, and thin film physics.
- Hands-on experience with patterning films such as photoresist, hard masks, and spacers.
- Experience with ALD, CVD, PECVD, PE-ALD, and/or LPCVD processes.
- Knowledge of SPC and process maturity for manufacturable technologies.
Responsibilities
- Develop, optimize, and transfer thin film deposition processes for EUV-enabled DRAM.
- Lead process characterization, troubleshooting, and defect reduction through VME.
- Drive thin film roadmap activities aligned to future technology nodes.
- Collaborate with internal teams and suppliers to mature equipment, chemistries, and process solutions.
- Analyze large physical and electrical datasets and communicate recommendations.
Skills
Education
Tools
Job description
Micron Technology in New York is seeking a Thin Films Engineer to develop and transfer deposition processes that enable EUV-enabled DRAM. You will own thin film concepts from early development through high-volume manufacturing and partner with multidisciplinary teams to deliver robust, scalable solutions.
The role requires a PhD or MS with several years in semiconductor materials or process development, with hands-on experience in ALD/CVD processes and patterning films.
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