R&D Thin Films Process Development Engineer Advanced DRAM

Micron Technology, Inc

Boise (ID)

On-site

USD 120,000 - 180,000

Full time

8 days ago

Get more replies from employers

Send a job-specific resume in minutes.

Benefits offered by this job

Medical, dental and vision plans
Paid time off
Paid holidays

Job summary

Micron Technology, Inc in Boise, Idaho, is seeking a R&D Thin Films Process Development Engineer for Advanced DRAM. This role owns dielectric deposition processes and collaborates across integration, equipment, and operations to deliver robust, scalable solutions for high‑yield devices.

Ideal candidates have 5+ years in semiconductor thin‑film deposition, hands‑on deposition and troubleshooting, and knowledge of ALD, epitaxy or plasma‑based methods.

Qualifications

  • Masters degree with 2+ years experience in Physics, Chemistry, Chemical Engineering, Materials Science or related field OR PhD with relevant industry experience.
  • Hands-on experience with thin-film deposition and process troubleshooting.
  • Working knowledge of ALD, epitaxy, or plasma-based deposition fundamentals.
  • Experience using data-driven methods such as DOE, SPC, and basic materials characterization.
  • Ability to work independently and clearly communicate technical results.

Responsibilities

  • Drive development and maturity of thin-film deposition processes for High Aspect Ratio Advanced DRAM features and devices.
  • Collaborate with integration, equipment, and operations to deliver robust, scalable solutions.
  • Lead cross-functional teams to influence technical and strategic decisions and track project milestones.

Skills

Thin-film deposition
Deposition troubleshooting
ALD / epitaxy / plasma basics
Data-driven methods (DOE, SPC)
Independent communication of results
AI / coding / automation in process
Cross-functional teamwork

Education

Master’s degree + 2+ years
PhD with relevant industry

Job description

JR96415 R&D Thin Films Process Development Engineer Advanced DRAM

Our vision is to transform how the world uses information to enrich life for all.

Our vision is to transform how the world uses information to enrich life for all!!

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

We are part of Micron’s Advanced DRAM Technology Development organization, where we push the limits of memory technology every day. Our team works at the intersection of materials science, hardware, and manufacturing to bring next‑generation DRAM devices to life. We collaborate closely, test bold ideas, and move fast to turn innovation into results.

This role is critical to building the thin‑film foundations of advanced DRAM devices. As a Process Development Engineer focused on dielectric deposition, you will own key processes, influence technical direction, and work hands‑on with state‑of‑the‑art tools. You’ll partner across integration, equipment, and operations to deliver robust, scalable solutions that meet aggressive performance and yield goals!

  • Technically innovate: Drive strategic, technical, and tactical decisions at a project and platform level by contributing to feasibility studies; Proactively engage technical challenges before they become problems. Key processes for this role will be the development/incorporation of new and improved thin films deposition to build High Aspect Ratio Advanced DRAM Features and Devices.
  • Operationally Focus: Have the vision and operational understanding to relate on wafer performance to hardware performance, and drive solutions to improve key film metrics like uniformity, conformality, quality, selectivity and electrical or optical performance.
  • Impact Results: Lead initiatives to ensure your projects are meeting the technical and operational requirements to ensure program KPI’s.
  • Influence: Regularly interact with and lead cross‑functional teams to influence technical and strategic decisions; builds strong relationships with the suppliers.
  • Skill and experience: Regularly drive project roadmaps, execute to development and maturity timelines, drive meaningful thin‑films improvements within the hardware‑process space. Deliver meaningful messages to leadership team to communicate status and plans with focus on technical fundamentals and model‑based problem solving
  • Master’s degree with 2+ years of experience in Physics, Chemistry, Chemical Engineering, Materials Science, or related field OR PhD research with relevant industry experience
  • Hands‑on experience with thin‑film deposition and process troubleshooting
  • Working knowledge of ALD, epitaxy, or plasma‑based deposition fundamentals
  • Experience using data‑driven methods such as DOE, SPC, and basic materials characterization
  • Ability to work independently and clearly communicate technical results
  • 5+ years of experience in semiconductor thin‑film deposition or manufacturing
  • Experience applying AI, coding, automation, or data science in process development
  • Proven ability to deliver results through cross‑functional teamwork

Job Profile(s): Semiconductor Process Engineer 4

Relocation Level: TBD

  • Micron benefits are designed to help you stay well, provide peace of mind and help you prepare for the future.
  • We offer a choice of medical, dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget.
  • Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury, and paid family leave.
  • Additionally, Micron benefits include a robust paid time-off program and paid holidays.

Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws.

Get your free, confidential resume review.
or drag and drop your file here.
Similar jobs

Similar jobs worth comparing

R&D Thin Films Process Development Engineer Advanced DRAM
R&D Thin Films Process Development Engineer Advanced DRAM

1000 Micron Technology, Inc. • Boise (ID)

On-site
USD 90,000 - 130,000
Medical, dental and vision plans
Paid family leave
Robust paid time‑off program
+1
R&D Thin Films Process Development Engineer Advanced DRAM
R&D Thin Films Process Development Engineer Advanced DRAM

Micron Technology • Boise (ID)

On-site
USD 90,000 - 140,000
Thin Films Advanced DRAM Process Development (Open)
Thin Films Advanced DRAM Process Development (Open)

Micron Technology, Inc • Boise (ID)

On-site
USD 80,000 - 110,000
Medical, dental, and vision plans
Income protection
Paid family leave
+1
Experienced- R&D Thin Films Process Development Engineer Advanced DRAM (Evergreen)
Experienced- R&D Thin Films Process Development Engineer Advanced DRAM (Evergreen)

1000 Micron Technology, Inc. • Boise (ID)

On-site
USD 80,000 - 110,000
Medical, dental, and vision plans
Paid family leave
Robust paid time-off program
+1
Experienced- R&D Thin Films Process Development Engineer Advanced DRAM (Evergreen)
Experienced- R&D Thin Films Process Development Engineer Advanced DRAM (Evergreen)

Micron Technology • Boise (ID)

On-site
USD 85,000 - 120,000
Medical, dental, and vision plans
Paid family leave
Robust paid time-off program
Films Process Development Engineer
Films Process Development Engineer

Micron Technology, Inc • Boise (ID)

On-site
USD 80,000 - 120,000
Medical, dental and vision plans
Income protection programs
Paid family leave
+2
Films Process Development Engineer
Films Process Development Engineer

1000 Micron Technology, Inc. • Boise (ID)

On-site
USD 80,000 - 110,000
Medical, dental, and vision plans
Paid family leave
Robust paid time-off program
Films Process Development Engineer
Films Process Development Engineer

Micron Technology • Boise (ID)

On-site
USD 90,000 - 120,000
Medical, dental and vision plans
Paid family leave
Robust paid time-off program
+1
Advanced DRAM Process Integration Engineer
Advanced DRAM Process Integration Engineer

Micron Technology, Inc • Boise (ID)

On-site
USD 100,000 - 130,000
Choice of medical, dental, and vision plans
Paid family leave
Robust paid time-off program
+1
R&D Thin Films Process Development Engineer Advanced DRAM Boise, Idaho, United States of Americ[...]
R&D Thin Films Process Development Engineer Advanced DRAM Boise, Idaho, United States of Americ[...]

Micron Technology, Inc • Boise (ID)

Hybrid
USD 90,000 - 150,000