Engineering Manager, EMS PCBA & SMT Programming

Jobtailor

Seymour (CT)

On-site

USD 90,000 - 120,000

Full time

5 days ago

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Job summary

Jobtailor is seeking a senior engineering leader to oversee Technical Engineering, Document Control, and SMT Programming on complex electronics assembly projects in Seymour, CT. You will drive onboarding, data validation, and release processes for customer BOMs, Gerber data, and CAD files, while managing cross‑functional teams on quality and process improvements.

The role requires extensive SMT programming experience, especially with FUJI NXT III platforms, and strong ERP/MES proficiency.

Qualifications

Bachelor’s degree in Engineering or related technical discipline; equivalent electronics manufacturing and SMT programming experience will be considered
Minimum 5+ years of progressive engineering experience within electronics contract manufacturing (EMS), technical documentation, SMT programming, or manufacturing engineering
Demonstrated supervisory or technical team leadership experience
Deep experience in high‑mix, low‑to‑medium volume PCBA production environments
Advanced understanding of PCBA assembly processes, surface‑mount technology, through‑hole soldering, and technical documentation lifecycles
Hands‑on proficiency with SMT machine programming software; direct experience on FUJI SMT equipment (FUJI NXT III platforms) strongly preferred
Advanced knowledge of electronic components including 0201/01005 passives, BGAs, QFNs, CSPs, connectors, polarity standards
Ability to read, interpret, and validate CAD, Gerber, schematic, centroid, and drawing datasets
IPC‑A‑610 solder inspection certification
Proficiency in MES (Aegis MES) and Infor ERP systems
Experience with Gerber viewing/editing tools, CAD/CAM data conversion software, and PLM systems
Advanced Microsoft Excel capabilities including data modeling and VBA
Strong analytical troubleshooting, root‑cause problem solving using 8D/A3, configuration management
Ability to work in a technical office and active SMT manufacturing floor environment

Responsibilities

Provide strategic leadership across Technical Engineering, production documentation, and SMT programming
Manage and mentor Technical Engineering, Document Control, and SMT Programming personnel
Establish workflows, accountability mechanisms, quality metrics, and cross‑training programs
Interface with Manufacturing Operations, Process Engineering, Quality Assurance, Program Management, Supply Chain, and Planning
Coordinate technical onboarding, skills assessments, and staff training
Direct intake, conversion, validation, and release of customer BOMs, Gerber files, CAD layouts, centroid files, fabrication drawings, and test procedures
Review technical data and escalate missing, ambiguous, or conflicting design information
Facilitate technical readiness from data receipt through production traveler release
Review, release, and maintain work instructions, SOPs, and quality documentation
Enter customer BOMs and technical parameters into MRP/ERP systems such as Infor
Build and maintain process routings, operation steps, model points, and digital workflows in Aegis MES
Execute ECOs and synchronize drawings, BOM revisions, machine programs, and work instructions
Disseminate Quality Bulletins and enforce configuration and revision control
Lead SMT programming for FUJI NXT III high‑speed placement lines
Generate, verify, optimize, and maintain SMT placement programs
Supervise the SMT component package library and validate geometries, land patterns, dimensions, polarities, rotations, and feeder/nozzle assignments
Optimize placement sequences, line balancing, feeder layouts, and machine cycle times to improve OEE
Provide shop‑floor engineering support during FAI, NPI, and prototype runs
Investigate placement defects, component rotation errors, package mismatches, and machine faults
Identify automation opportunities for technical engineering and programming workflows
Develop and maintain VBA tools and automated Excel templates
Monitor and report KPIs including program lead time, programming accuracy, first‑pass placement yield, and engineering cycle times