Electronics Packaging Mechanical Intern — CAD & Thermal Modeling

Keysight Technologies; Santa Rosa (CA); On-site; USD 91,745,000 - 142,124,000; Full time

Job summary

Keysight Technologies in Santa Rosa, CA is seeking a motivated student pursuing a Mechanical Engineering degree to develop thermal and mechanical models for electronics packaging. You will collaborate in a multi-disciplinary team to evaluate new packaging technologies, document designs and assemblies, and gain hands-on experience with 3D CAD (Siemens NX) and fabrication processes.

Applicants must be enrolled in an accredited college as of Sep 2027; visa sponsorship is not available; strong

Qualifications

• Working towards a degree in Mechanical Engineering or related field
• Strong interest in the mechanical design of electronics packaging
• Experience with 3D CAD (Siemens NX)
• Understanding of fabrication processes (machining, die casting, plastic molding, sheet metal) and engineering materials
• Experience/interest with mechanical thermal and stress FEA analysis tools
• Self-starter with the ability to generate new ideas, navigate a dynamic environment and deliver results
• Excellent written and verbal skills and ability to work across multiple disciplines
• Candidates must be enrolled in an accredited college/university as of September 2027 and visa sponsorship is not available

Responsibilities

• Develop thermal and mechanical models to solve challenging electronics packaging issues
• Work within a multi-discipline project team to investigate and evaluate new electronics packaging technologies
• Document new designs and assemblies

Skills

Siemens NX

FEA tools

Mechanical design

Communication skills

Self-starter

Engineering fundamentals

Education

Pursuing Bachelor's degree in Mechanical Engineering or related field

Job description

Keysight Technologies in Santa Rosa, CA is seeking a motivated student pursuing a Mechanical Engineering degree to develop thermal and mechanical models for electronics packaging. You will collaborate in a multi-disciplinary team to evaluate new packaging technologies, document designs and assemblies, and gain hands-on experience with 3D CAD (Siemens NX) and fabrication processes.

Applicants must be enrolled in an accredited college as of Sep 2027; visa sponsorship is not available; strong