Electronics Packaging Engineer for Power Systems

US Health Partners, LLC; Los Angeles (CA); On-site; USD 90,000 - 135,000; Full time

Job summary

Karman Industries is seeking a highly motivated Mechanical Engineer specialized in electronics packaging to lead design and qualification for the Heat Processing Unit. You will address mounting, isolation, heat transfer, and manufacturability while collaborating with cross-functional teams to deliver robust power conversion systems.

The role emphasizes a strong first-principles approach, hands-on enclosure expertise, and a clear path from concept to manufacturing-ready packaging solutions in a

Qualifications

• BSc in mechanical engineering or equivalent is required.
• 3+ years of experience designing packaging for electrical hardware.
• Hands-on experience with enclosures and electrical connectors.
• Knowledge of basic DFM practices.
• Self-motivated with strong ability to self-manage and multitask.

Responsibilities

• Define electronics packaging strategies for power electronics systems, including inverters and drives.
• Design mounting and isolation systems for PCBs and electrical assemblies.
• Collaborate with manufacturing engineers to identify viable fabrication methods for packaging and enclosures.
• Coordinate with thermal analysis experts to identify thermal and thermo-mechanical factors in component lifecycles.
• Integrate thermal, mechanical, and electrical designs into cohesive power conversion products.
• Develop analytical, first-principles models to determine hardware performance and limitations.

Skills

Packaging design

DFM practices

Multitasking

Education

B.Sc. in mechanical engineering

Job description

Karman Industries is seeking a highly motivated Mechanical Engineer specialized in electronics packaging to lead design and qualification for the Heat Processing Unit. You will address mounting, isolation, heat transfer, and manufacturability while collaborating with cross-functional teams to deliver robust power conversion systems.

The role emphasizes a strong first-principles approach, hands-on enclosure expertise, and a clear path from concept to manufacturing-ready packaging solutions in a