Thermal Management Engineer - Power Electronics & Cooling

US Health Partners, LLC; Los Angeles (CA); On-site; USD 110,000 - 150,000; Full time

Job summary

Karman Industries in Gardena, California, is seeking a Mechanical Engineer to lead thermal management design for power electronics and cooling systems for advanced HPU development. You will develop first-principles analyses, define cooling strategies, and work with cross-disciplinary teams to integrate thermal, mechanical, and electrical designs.

Joining this team means applying hands-on experience with heat transfer, materials, and DFMs to deliver reliable, scalable solutions for data centers

Qualifications

• B.Sc. in mechanical engineering.
• 3+ years of experience in thermal management for electrical hardware.
• Hands-on experience with heat transfer systems and materials.
• Knowledge of basic DFM practices.
• Self-motivated with strong communication, multi-tasking and self-management abilities.

Responsibilities

• Define cooling strategies for power electronics systems, including inverters, drive systems, power supplies, and controls
• Design heat management systems for PCBs and electrical assemblies
• Collaborate with manufacturing engineers to identify viable fabrication methods for cold plates, immersion liquids, heat transfer materials, and enclosures
• Coordinate with materials experts to identify thermal and thermo-mechanical factors in lifespan of subcomponents
• Work with a cross-disciplinary team to integrate thermal, mechanical, and electrical designs into cohesive power conversion products
• Develop novel solutions to challenging problems using first principles thinking
• Develop analytical, physics-based models to determine hardware performance and limitations

Skills

Self-motivation

Problem solving

Collaboration

First principles modeling

Physics-based modeling

Team orientation

Thermal management

Education

B.Sc. in mechanical engineering

Job description

Karman Industries in Gardena, California, is seeking a Mechanical Engineer to lead thermal management design for power electronics and cooling systems for advanced HPU development. You will develop first-principles analyses, define cooling strategies, and work with cross-disciplinary teams to integrate thermal, mechanical, and electrical designs.

Joining this team means applying hands-on experience with heat transfer, materials, and DFMs to deliver reliable, scalable solutions for data centers