Director, SoC Design & AI/ML Engineering

GlobalFoundries inc.; Richardson (TX); On-site; USD 191,000 - 332,000; Full time

Job summary

GlobalFoundries, a leading semiconductor foundry, seeks an experienced Director of Design Engineering to lead complex SoC programs across advanced technologies. The role drives architectural execution, front-end design methodology, and cross-functional collaboration from concept through tape-out and productization.

You will build and mentor high-performing design teams, define design strategies for low-power, chiplet integration, and advanced packaging, while partnering with architecture,

Qualifications

• 15+ years of semiconductor design experience with progressive leadership.
• 8+ years of engineering management experience leading senior technical teams.
• Proven track record delivering ASIC/SoC tape-outs across advanced technology nodes.
• Deep front-end design expertise including RTL and integration.
• Strong customer-facing and executive communication skills.

Responsibilities

• Lead the design and execution of complex SoC, AI/ML, networking, compute, or edge-processing products.
• Drive front-end development from architecture through RTL implementation and tape-out readiness.
• Establish and enforce best-in-class design methodologies and quality metrics.
• Guide decisions on performance, power, area, reliability, and manufacturability.
• Mentor multi-disciplinary, global design teams across architectures and flows.
• Collaborate with architecture, verification, DFT, physical design, and foundry teams.

Skills

Executive communication

RTL design

Leadership

Education

Bachelor's/Master's/Ph.D. in Electrical Engineering or Computer Engineering

Job description

GlobalFoundries, a leading semiconductor foundry, seeks an experienced Director of Design Engineering to lead complex SoC programs across advanced technologies. The role drives architectural execution, front-end design methodology, and cross-functional collaboration from concept through tape-out and productization.

You will build and mentor high-performing design teams, define design strategies for low-power, chiplet integration, and advanced packaging, while partnering with architecture,