Director, Physical Design Engineering

SBT; Boston (MA); Remote; USD 180,000 - 280,000; Full time

Job summary

A confidential semiconductor firm is seeking a Director of Physical Design Engineering to build and lead a new PD organization. This leadership role involves hands-on technical guidance in complex physical design activities and the full lifecycle of advanced semiconductor development. Ideal candidates will have over 10 years of experience in Physical Design and proven leadership capabilities. The position is remote with occasional travel requirements.

Qualifications

• 10+ years of industry experience in Physical Design engineering.
• 5+ years of leadership experience managing Physical Design teams.
• Strong experience in floorplanning and power distribution.
• Collaborates with architecture, RTL, packaging, and system teams on complex SoCs.
• Experience with DSP‑based chip architectures is a strong plus.

Responsibilities

• Provide hands-on technical leadership in physical design.
• Drive end-to-end physical implementation and execution.
• Build and scale a Physical Design organization from scratch.
• Partner with architects to define major physical structures at block, cluster, and top levels.
• Collaborate with cross‑functional teams to ensure silicon readiness and seamless product execution.

Skills

Leadership in Physical Design engineering

Full-chip implementation expertise

Multi-IP integration

Timing closure and tapeout signoff

Collaboration with architecture and RTL design teams

Job description

President at SBT | 19 years of advising leaders at semiconductor and deep tech companies | Architecting teams from startups to F500 organizations

Company Overview

This confidential client is strategically bringing on a Director of Physical Design Engineering to build and lead a PD organization from the ground up. This is a highly technical, hands‑on leadership role responsible for architecting physical implementation strategy, driving execution across complex SoCs, and shaping the long‑term direction of the company’s chip development efforts. The Director will collaborate cross‑functionally with systems hardware teams, software architects, and executive leadership while guiding a growing team through the full lifecycle of advanced semiconductor development.

Responsibilities

• Provide hands‑on technical leadership across complex physical design activities, including clock/reset architecture, power delivery networks, floorplanning, routing strategies, and interconnect topology development.
• Drive end‑to‑end physical implementation—from synthesis, floorplanning, power planning, and place‑and‑route through timing closure, physical verification, and final tapeout.
• Build and scale a Physical Design organization from scratch, including hiring, mentoring, establishing methodologies, and defining best‑in‑class PD workflows.
• Partner with architects and micro‑architects to define, explore, and construct major physical structures at block, cluster, and top levels.
• Collaborate closely with cross‑functional teams to ensure seamless product execution and successful high‑volume silicon readiness.

Qualifications

• 10+ years of industry experience in Physical Design engineering, with deep expertise across full‑chip implementation, advanced nodes, multi‑IP integration, timing closure, and tapeout signoff.
• 5+ years of leadership experience, including building and leading Physical Design teams or organizations.
• Demonstrated success owning top‑level floorplanning, clock/power distribution, physical verification, and large‑scale P&R implementation.
• Strong experience collaborating with architecture, RTL design, packaging, and system teams on complex SoC programs.
• Experience with DSP‑based chip architectures is a strong preference.

This role is remote with occasional travel to the on‑site location.

Seniority level

Director

Employment type

Full‑time

Job function

Semiconductor Manufacturing and Computer Hardware Manufacturing