Director of Mechanical & Thermal Engineering

Oracle; Santa Clara (CA); On-site; USD 170,000 - 355,000; Full time

Job summary

Oracle in Santa Clara seeks a senior mechanical/thermal engineering leader to direct design and delivery of high‑performance compute hardware. You will own mechanical, thermal, and human factors work from concept through qualification and production ramp, ensuring reliability, serviceability, and cost targets.

You will mentor managers, set standards, and resolve cross‑functional tradeoffs with electrical, software, and supplier teams while shaping next‑generation roadmaps for GPUs, servers, and

Qualifications

• BS in Mechanical Engineering (or equivalent); MS preferred.
• 12+ years in mechanical, thermal, or platform engineering for complex hardware.
• 5+ years of people leadership, including managing managers.
• Experience with industry-standard CAD, CFD, and PLM tools.

Responsibilities

• Own mechanical and thermal delivery from concept through qualification and production ramp.
• Lead mechanical, thermal, industrial design, and human factors specialists through clear standards and delegated ownership.
• Resolve cross-program tradeoffs with electrical, SI/PI, power, firmware/software, quality, program, datacenter, and OEM/ODM partners.
• Set lifecycle sign-off criteria and escalation paths for performance, cost, schedule, reliability, serviceability, and supply risk.
• Align interfaces and design margins with engineering and operations; drive next-generation roadmaps.

Skills

Mechanical engineering

Leadership

CAD

CFD

Reliability testing

Education

BS in Mechanical Engineering

MS preferred

Tools

CAD tools

CFD

PLM

Job description

Oracle in Santa Clara seeks a senior mechanical/thermal engineering leader to direct design and delivery of high‑performance compute hardware. You will own mechanical, thermal, and human factors work from concept through qualification and production ramp, ensuring reliability, serviceability, and cost targets.

You will mentor managers, set standards, and resolve cross‑functional tradeoffs with electrical, software, and supplier teams while shaping next‑generation roadmaps for GPUs, servers, and