Principal Application Engineer – semiconductor packaging

Intermedia Group Inc.; Irvine (CA); On-site; USD 130,000 - 155,000; Full time

Benefits offered by this job

Relocation assistance

Job summary

Adhesive Technologies in Irvine, CA is seeking a Principal Application Engineer specializing in semiconductor packaging. You will develop KPI results and drive data-driven improvements, leveraging 2.5D, HBM, CoWoS packaging trends to accelerate material testing and test-vehicle development.

You will serve as the primary technical interface to leading edge clients, manage a small team of 2-4 application engineers, and collaborate with sales, marketing, PD, and other units.

Qualifications

• Bachelor’s degree in Materials Science, Chemical Engineering, Mechanical Engineering, or related field.
• 12 years of experience in semiconductor packaging or processes with people manager experience.
• Solid understanding of current and emerging packaging trends, including 2.5D and 3D packaging.
• Proven ability to work independently and lead technical discussions with customers.
• Strong communication skills with a customer-focused, ownership-driven mindset.
• Effective project and time management skills, with a consistent focus on quality and delivery.
• Willingness to travel up to 10%.
• Ability to take meetings with our APAC team during off-hours.

Responsibilities

• Develop and evaluate KPI results and drive innovation and continuous improvement via data driven decisions and actions.
• Leverage semiconductor knowledge in advanced packaging e.g. 2.5D, HBM, CoWoS technical requirement and trend to accelerate material testing and test vehicle development.
• Primary technical interface to leading edge clients, addressing and resolving issues related to product implementation, functionality, or performance.
• Responsible for application functions and tasks to sales, marketing, PD and other business units.
• Manage a small (2-4) Application Engineering team to achieve project deliverables.

Education

Bachelor’s degree in Materials Science, Chemical Engineering, Mechanical Engineering, or related field

Job description

Principal Application Engineer – semiconductor packaging

• Irvine, CA
• $130,000 to $155,000

OPEN JOB: Principal Application Engineer – semiconductor packaging

LOCATION:Irvine, California
***Relocation Assistance Available

INDUSTRY:Manufacturing & Production

BASE SALARY: $130,000 to $155,000

This position is with our client’s Adhesive Technologies business unit (adhesives, sealants and functional coatings)

What you´ll do

• Develop and evaluate KPI results and drive innovation and continuous improvement via data driven decisions and actions
• Leverage semiconductor knowledge in advanced packaging e.g. 2.5D, HBM, CoWoS technical requirement and trend to accelerate material testing and test vehicle development
• Primary technical interface to leading edge clients, addressing and resolving issues related to product implementation, functionality, or performance
• Responsible for application functions and tasks to sales, marketing, PD and other business units
• Manage a small (2-4) Application Engineering team to achieve project deliverables

Requirements:

• Bachelor’s degree in Materials Science, Chemical Engineering, Mechanical Engineering, or related field
• 12 years of experience in semiconductor packaging or processes with people manager experience
• Solid understanding of current and emerging packaging trends, including 2.5D and 3D packaging
• Proven ability to work independently and lead technical discussions with customers
• Strong communication skills with a customer-focused, ownership-driven mindset
• Effective project and time management skills, with a consistent focus on quality and delivery
• Willingness to travel up to 10%
• Ability to take meetings with our APAC team during off-hours