Director of Engineering - AI Interconnects & Data Center

Amphenol Communications Solutions; Harrisburg (Dauphin County); On-site; USD 140,000 - 190,000; Full time

Job summary

Amphenol Communications Solutions is seeking a Director of Engineering in Valley Green, PA to lead the Backplane OverPass Engineering team located in Etters, PA. The role requires guiding product development from concept to volume production and coordinating across engineering, operations, quality, and sales.

You will champion high-speed interconnect technologies for AI workloads, ensuring robust signal integrity and timely delivery to major hyperscale customers.

Qualifications

• Bachelor's or Master’s degree in Electrical/Mechanical Engineering or related field.
• 8+ years in high-speed interconnect, data center hardware, or AI system development.
• Proven leadership of multi-disciplinary teams.
• Experience with PCIe, Ethernet, InfiniBand and AI workloads.

Responsibilities

• Lead a multidisciplinary engineering team responsible for product development, mechanical and electrical design, program execution, and validation.
• Own the engineering lifecycle from concept through NPI to volume production.
• Drive program management and cross-functional alignment across engineering, operations, quality, and sales teams.
• Oversee signal integrity strategy, test development, and performance validation for high-speed interconnect products (e.g., 112G PAM4 and beyond).
• Interface directly with leading AI system and hyperscale customers to define interconnect solutions optimized for their architectures.

Skills

Leadership

Cross-functional

Signal integrity

High-speed design

Education

Electrical/Mechanical Eng (BS/MS)

Job description

Amphenol Communications Solutions is seeking a Director of Engineering in Valley Green, PA to lead the Backplane OverPass Engineering team located in Etters, PA. The role requires guiding product development from concept to volume production and coordinating across engineering, operations, quality, and sales.

You will champion high-speed interconnect technologies for AI workloads, ensuring robust signal integrity and timely delivery to major hyperscale customers.