Director, HBM RTL Design and Integration

Micron; Richardson (TX); On-site; USD 177,000 - 348,000; Full time

Benefits offered by this job

Medical, dental and vision plans

Paid time-off

Paid holidays

Equity and bonus programs

Job summary

Micron Technology is seeking a Director of HBM RTL Design and Integration to spearhead RTL development and IP integration for next-gen HBM SoCs. You will drive technical strategy across architecture, verification, physical design, firmware, and product engineering to deliver robust, manufacturable solutions.

You will lead cross-functional teams across multiple generations, manage trade-offs among performance, power, area, and schedule, and build a high-performing RTL design organization with

Qualifications

• Proven experience leading large-scale SoC design teams delivering complex SoCs to advanced process nodes (e.g., TSMC).
• Deep expertise in RTL design, SoC integration, and full RTL-to-GDS flows, including synthesis, timing, and signoff considerations.
• Strong experience integrating complex IP subsystems (controllers, NOC, microcontrollers, PHY-adjacent logic, RAS, MBIST, interfaces).
• Familiarity with EDA tools and scripting languages (SystemVerilog, Python, TCL).
• Knowledge of DRAM/HBM systems and JEDEC standards preferred.

Responsibilities

• Lead SoC RTL design and integration for HBM logic die, including subsystem partitioning, IP integration, and SoC-level design convergence.
• Drive translation of architectural and micro-architectural specifications into robust RTL implementations across multiple teams.
• Oversee SoC integration aspects, including clocking, reset, power intent, configuration infrastructure, and system-level design correctness.
• Establish design methodologies and best practices to improve quality, reuse, and development efficiency across HBM programs.
• Partner with SoC Architecture, Verification, Physical Design, Firmware, and System teams to ensure successful end-to-end product execution.
• Work closely with Product Engineering, Test, Probe, Process Integration, Assembly, and Manufacturing to ensure robust, manufacturable HBM solutions.
• Drive trade-offs among performance, power, area, schedule, and risk to ensure optimal product outcomes.
• Build, lead, and scale a high-performing RTL design and integration team, including recruiting, mentoring, and retention of top engineering talent.

Skills

SoC RTL design leadership

RTL design and integration

SoC program management

EDA tools & scripting

DRAM/HBM knowledge

Tools

SystemVerilog

Python

TCL

Job description

Our vision is to transform how the world uses information to enrich life for all. Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about driving innovation for next-generation memory solutions powering AI/ML and high-performance computing systems.

As a Director of HBM RTL Design and Integration, you will lead a team responsible for the design, integration, and delivery of next-generation HBM SoC logic die, with a strong focus on RTL development and IP integration. You will drive technical strategy and execution across multiple product generations, working closely with architecture, verification, physical design, firmware, and product engineering teams.

Key Responsibilities

• Lead SoC RTL design and integration for HBM logic die, including subsystem partitioning, IP integration, and SoC-level design convergence.
• Drive translation of architectural and micro-architectural specifications into robust, high-quality RTL implementations across multiple teams.
• Oversee SoC integration aspects, including clocking, reset, power intent, configuration infrastructure, and system-level design correctness.
• Establish design methodologies and best practices to improve quality, reuse, and development efficiency across HBM programs.
• Partner with SoC Architecture, Verification, Physical Design, Firmware, and System teams to ensure successful end-to-end product execution.
• Work closely with Product Engineering, Test, Probe, Process Integration, Assembly, and Manufacturing to ensure robust, manufacturable HBM solutions.
• Drive trade-offs among performance, power, area, schedule, and risk to ensure optimal product outcomes.
• Build, lead, and scale a high-performing RTL design and integration team, including recruiting, mentoring, and retention of top engineering talent.

Qualifications

• Proven experience leading large-scale SoC design teams delivering complex SoCs to advanced process nodes (e.g., TSMC).
• Deep expertise in RTL design, SoC integration, and full RTL-to-GDS flows, including synthesis, timing, and signoff considerations.
• Strong experience integrating complex IP subsystems (controllers, NOC, microcontrollers, PHY-adjacent logic, RAS, MBIST, interfaces).
• Familiarity with EDA tools and scripting languages (e.g., SystemVerilog, Python, TCL).
• Knowledge of DRAM/HBM systems and JEDEC standards preferred.

Preferred Qualifications

• 15+ years of relevant SoC design experience with increasing scope and technical leadership.
• Demonstrated success driving multiple tape-outs and cross-functional SoC programs.
• Strong leadership, communication, and organizational influence skills.
• Experience building and managing global engineering teams.

The US base salary range that Micron Technology estimates it could pay for this full-time position is:

$177,000.00 - $348,000.00 a year

Additional compensation may include benefits, bonuses and equity. Our salary ranges are determined by role, level, and location. The range displayed on each job posting reflects the minimum and maximum target base pay for new hire salaries of the position across all US locations. Within the range, individual pay is determined by work location and additional job-related factors, including knowledge, skills, experience, tenure and relevant education or training. The pay scale is subject to change depending on business needs. Your recruiter can share more about the specific salary range for your preferred location during the hiring process. Please note that the compensation details listed in US role postings reflect the base salary only, and do not include bonus, equity, or benefits.

As a world leader in the semiconductor industry, Micron is dedicated to your personal wellbeing and professional growth.

• Micron benefits are designed to help you stay well, provide peace of mind and help you prepare for the future.
• We offer a choice of medical, dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget.
• Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury, and paid family leave.
• Additionally, Micron benefits include a robust paid time-off program and paid holidays.

For additional information regarding the Benefit programs available, please see the Benefits Guide posted on micron.com/careers/benefits .

Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity or any other factor protected by