Director, Application Engineering — Packaging & Thermal

Diamondfoundry

San Francisco (CA)

On-site

USD 180,000 - 280,000

Full time

14 days+

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Benefits offered by this job

Health insurance
Flexible spending accounts
Retirement savings plans
Life and disability insurance
Paid time away from work

Job summary

Diamond Foundry Inc. is expanding its application engineering team to support semiconductor customers with diamond-based solutions for advanced packaging and thermal management.

We seek a motivated leader to drive adoption and scale partnerships in this cutting-edge field. The ideal candidate holds 8+ years in semiconductor packaging/thermal management, with hands-on development and a track record of moving from R&D to mass production.

Qualifications

  • 8+ years in semiconductor packaging or thermal management.
  • Deep understanding of advanced packaging and 2.5D/3D IC thermal solutions.
  • Ability to scale from concepts/R&D to mass production.
  • Strong cross-functional leadership and communication skills.

Responsibilities

  • Lead and grow the application engineering function focused on semiconductor packaging and thermal management applications.
  • Drive development and optimization of diamond-based solutions for advanced packaging and thermal interfaces.
  • Provide in-depth technical expertise on thermal management principles and material characterization.
  • Collaborate with R&D and product teams to define roadmaps and identify new opportunities.

Skills

Leadership
Cross-functional teamwork
Technical communication
Semiconductor packaging

Education

Bachelor's or Master's in Materials Science, Chemistry, Electrical Engineering, Mechanical Engineering

Job description

Diamond Foundry Inc. is expanding its application engineering team to support semiconductor customers with diamond-based solutions for advanced packaging and thermal management.

We seek a motivated leader to drive adoption and scale partnerships in this cutting-edge field. The ideal candidate holds 8+ years in semiconductor packaging/thermal management, with hands-on development and a track record of moving from R&D to mass production.

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