Dielectric & Polymer Materials Engineer for Advanced Packaging

Absolics Inc; Covington (VA); On-site; USD 90,000 - 150,000; Full time

Benefits offered by this job

401K matching

Healthcare coverage

Life insurance

Cell phone allowance

PTO & development

Job summary

Absolics Inc in Covington, GA is seeking a R&D Engineer—Dielectric and Polymer Materials Expert for Advanced Packaging applications to lead evaluation, down-select, and integration of dielectric materials.

You will drive material selection, deposition, patterning, cure characterization, and reliability testing, collaborating with downstream teams to optimize performance across electrical, mechanical, and reliability dimensions.

Qualifications

• Hands-on experience evaluating and qualifying advanced packaging dielectrics.
• Deep knowledge of dielectric patterning and lamination processes.
• Extensive film characterization using ellipsometry, FTIR, TGA/DSC.
• Understanding of adhesion, CTE mismatch and stress in multilayer stacks.
• Experience with electrical characterization of dielectric films (Dk, Df, leakage).
• Ability to perform JEDEC reliability testing (HAST, uHAST, TCT).
• Fluent English; Korean language skills are a plus.

Responsibilities

• Characterize dielectric film properties and relate to reliability.
• Define process windows for advanced packaging dielectrics for RDL build-up.
• Support processing condition optimization across teams.
• Evaluate emerging dielectric materials for roadmap fit.
• Develop cure, lamination, or photopatterning sequences.
• Investigate failures due to adhesion, delamination, or CTE-mismatch.
• Run reliability tests (HAST, TCT) and analyze failure mechanisms.

Skills

Dielectric materials evaluation

Dielectric patterning

Film characterization

Adhesion & CTE

Electrical testing

JEDEC reliability testing

English fluency

Korean language (plus)

Education

Ph.D. in Materials Science or related field

M.S. with 3+ years experience

Job description

Absolics Inc in Covington, GA is seeking a R&D Engineer—Dielectric and Polymer Materials Expert for Advanced Packaging applications to lead evaluation, down-select, and integration of dielectric materials.

You will drive material selection, deposition, patterning, cure characterization, and reliability testing, collaborating with downstream teams to optimize performance across electrical, mechanical, and reliability dimensions.