Dielectric & Polymer Materials Engineer, Advanced Packaging

Absolics Inc.; Covington (GA); On-site; USD 110,000 - 140,000; Full time

Benefits offered by this job

401K matching

Healthcare coverage

Collaborative R&D environment

Job summary

Absolics Inc. in Covington, GA seeks an R&D Engineer specializing in dielectric and polymer materials for Advanced Packaging applications.

You will lead evaluation, selection, deposition, patterning, cure characterization, and reliability testing across multiple teams to optimize dielectric performance in RDL constructs. The role demands deep materials science knowledge and process integration, with hands-on experience in ABF, PBO, PSPI, polyimide and inorganic dielectrics.

Qualifications

• Experience evaluating, processing, or qualifying multiple advanced packaging dielectrics (e.g., ABF, PBO, PSPI, polyimide).
• Strong knowledge of dielectric patterning, photoexposure, development, cure sequences or lamination and laser drilling.
• Hands-on film characterization and reliability testing per industry standards.

Responsibilities

• Characterize dielectric film properties and correlate to process and reliability outcomes.
• Select and qualify process windows for dielectrics used in RDL build-up.
• Define optimal processing conditions across cross-functional teams.
• Evaluate new dielectric materials for roadmap fit (low-Dk/Df, glass-core systems).
• Develop cure, lamination, or photopatterning sequences for new layers.
• Investigate adhesion, delamination, cracking, and CTE-mismatch failures.
• Run reliability qualification testing (HAST, TCT) and interpret failure mechanisms.

Skills

Dielectric materials

Electrical characterization

Reliability testing

Patterning knowledge

Film deposition

CTE management

English fluency

Education

Ph.D. in Materials Science

M.S. in related field

Tools

Ellipsometry

FTIR

TGA/DSC

Profilometry

Nanoindentation

Job description

Absolics Inc. in Covington, GA seeks an R&D Engineer specializing in dielectric and polymer materials for Advanced Packaging applications.

You will lead evaluation, selection, deposition, patterning, cure characterization, and reliability testing across multiple teams to optimize dielectric performance in RDL constructs. The role demands deep materials science knowledge and process integration, with hands-on experience in ABF, PBO, PSPI, polyimide and inorganic dielectrics.