Die Attach Operator II — Precision Semiconductor Assembly

Micross; Milpitas (CA); On-site; USD 28,000 - 33,000; Full time

Job summary

Integra Technologies Inc. in Milpitas, CA is hiring a Full Time ISV Manufacturing Labor to perform die bonding and related assembly tasks on multiple production lines.

The role requires operating automatic and manual equipment, following process travelers, and maintaining safety and quality standards. You will work with equipment such as Datacon, MAT6400, SEC machines, Asymtek dispensers, and RTC/WJ furnaces to assemble IC dies.

Qualifications

• High school diploma or above required.
• 6 months of semiconductor assembly in a production environment preferred.
• Experience in second optical inspection may be applicable.
• Experience with manual die attach operation, microscope and manual dispense equipment is valued.

Responsibilities

• Operate and monitor die attach processes on automatic and manual equipment.
• Perform die bonding and inspection per traveler instructions and specifications.
• Use X-ray, microscopes, and measurement tools to ensure quality.
• Recall and set profiles for die attach reflow on RTC and WJ furnaces.
• Operate SEC, DATACON, MAT6400, and Asymtek equipment per procedures.
• Follow safety guidelines and report process deviations to supervisor.

Skills

Manual Die Attach operation

Microscope

Following traveler instructions

Education

High School diploma or above

Tools

Datacon

MAT6400

SEC860

Asymtek dispensing machine

RTC furnace

WJ furnace

XYZ Micro VU measurement tool

Job description

Integra Technologies Inc. in Milpitas, CA is hiring a Full Time ISV Manufacturing Labor to perform die bonding and related assembly tasks on multiple production lines.

The role requires operating automatic and manual equipment, following process travelers, and maintaining safety and quality standards. You will work with equipment such as Datacon, MAT6400, SEC machines, Asymtek dispensers, and RTC/WJ furnaces to assemble IC dies.