Die Attach Operator Level 2

Integra Technologies.; Milpitas (CA); On-site; USD 55,000 - 75,000; Full time

Job summary

Integra Technologies Inc. in Milpitas, CA seeks a Die Attach Technician to perform automatic and manual die bonding, inspect with microscopes, and operate dispense and reflow equipment. The role involves setting up profiles, following travelers, and ensuring quality and safety.

Qualifications include a High School diploma and 6 months of semiconductor assembly experience; familiarity with Datacon, MAT6400, SEC860, and Asymtek is a plus. Training provided as needed.

Qualifications

• High School diploma or above required.
• 6 months of semiconductor assembly experience preferred.
• Experience with die attach, inspection, and dispensing equipment is a plus.

Responsibilities

• Operate die attach equipment and related tooling per traveler instructions.
• Perform X-ray inspection and microscope-based quality checks.
• Set up and run different die attach profiles and reflow processes.
• Follow safety and quality policies and report deviations to supervisor.

Skills

Manual Die Attach operation

Automatic Die Attach bonders

Microscope operation

Dispense equipment (EFD)

Die attach process

Education

High School diploma

Tools

Datacon

MAT6400

SEC860

Asymtek

Job description

JOB DESCRIPTION

If you are unable to complete this application due to a disability, contact this employer to ask for an accommodation or an alternative application process.

Milpitas, CA, US

Reports To: Production Manager

POSITION SUMMARY

Perform automatic and manual die bonding with various equipment that bonds integrated circuit dies to substrates, lead frames and package cavity.

KEY RESPONSIBILITIES/ESSENTIAL FUNCTIONS INCLUDE

Level 1:

• Operate Stud Pull Test procedure and certified spec.
• Operate Die Shear Process Test Procedure and certified specifications.
• Operate and inspect X-ray.
• Operate XYZ Micro VU measurement tool.
• Recognize and select fixture and tooling.
• Operate UV cure.
• Recall and select profile for die attach reflow on RTC furnace silver glass.
• Recall and select profile for die attach reflow on WJ furnace hermetic and solder paste.
• Recall plasma machine program per traveler instruction.
• Clean procedure (remove flux) bake.
• Manual dam & fill can control fillet around the die given less space on cavity of the package.
• Manual under fill and cure process.
• Operate Flip Chip Attach "SEC" machine.
• Operate Asymtek dispensing machine – old and new version.
• Operate MAT 6400 and Datacon.

Level 2:

• Mix glass beads in to epoxy follow the mix ration.
• Die attach with customer consigned epoxy (high or low viscosity).
• Manual attach DAP die without epoxy.
• Manual stacks dies attach or components attach.
• Tiny die (less than 0.015") use wood stick pickup epoxy for DA. Thin die (less than 0.006") use wood stick pickup epoxy for DA.
• Manual or Auto dispense and attach stiffener to device.
• Recall Program Flip Chip Attach "SEC" machine.
• Recall program on Asymtek dispensing machine – old and new version.
• Recall program on MAT 6400.
• Recall program Datacon Operation.
• Recall profile for silver glass reflow on RTC Furnace and Glass Seal.
• Recall profile for die attach reflow on WJ Furnace Hermetic and Solder paste.

Level 3:

• Select Eutectic Die Attach tooling, setup heat block temperature and operate machine.
• Setup Eutectic Die Attach machine included temperature.
• Setup new program Flip Chip Attach "SEC Machine".
• Setup new program on Asymtek dispensing machine old and new version.
• Setup New Program on MAT 6400.
• Setup New Program on Datacon Operation.

Level 4

• Set-up and operate automatic/manual Die Attach, Flip Chip and Dispenses equipment.
• Operate a variety of equipment, including high-powered microscopes, with speed and accuracy.
• Follow job traveler instructions accurately.
• Identify and report process deviations to supervisor.
• Meet quality goals, safety requirements, and follow company policies.
• Flexibility to perform other duties as assigned.

JOB REQUIREMENTS INCLUDE

Education: High School diploma or above required.

Experience:

• 6 months of semiconductor assembly in a Production environment preferred.
• Experience in second optical inspection may be applicable.

Knowledge/Skills:

• Experience with:
  • Manual Die Attach operation, Microscope and manual Dispense equipment (EFD, etc.).
  • Manual Dam & Fill operation and automatic equipment (Asymtek, etc.)
  • Automatic Die Attach bonders (Datacon, MAT6400, etc.).
  • Semi-automatic Flip Chip bonders (SEC860, etc.).

SUPERVISORY RESPONSIBILITIES

Total Number of Employees Directly Supervising: 0

Number of Subordinate Supervisors Reporting to Position: 0

This job description is intended to describe the general nature and level of work being performed. This is not intended to be an all-inclusive list of responsibilities, duties, skills required of employees so classified.

In addition, this is not an employment contract and should not be construed or interpreted as creating an implied or expressed guarantee of continued employment. The employment relationship at Integra Technologies Inc is by mutual consent (Employment at Will).

I have read the job description, as well as the physical requirements below, and understand the expectations. By signing below, I acknowledge that I am able to perform the essential functions and meet the minimum requirements.

EMPLOYEE___________________________________________ Date ____________

PHYSICAL REQUIREMENTS INCLUDE

• Stand
• Walk
• Sit
• Climb
• Reach above shoulders
• Squat/crouch/kneel
• Push/pull
• Lift
• Carry

Employee must use hands for repetitive action such as

• Firm grasping
• Fine manipulation

WORKING CONDITIONS INCLUDE

• General shop or store conditions
• General office environment
• Humid, extreme hot/cold temps (non-weather)