Device & Process Integration Lead

NXP Semiconductors NV

Austin (TX)

Vor Ort

USD 120.000 - 180.000

Vollzeit

vor 14 Stunden
Sei unter den ersten Bewerbenden

Eine vollständige Bewerbung in einer Minute

Maßgeschneiderter Lebenslauf und Anschreiben – versandbereit.

Schaffe es an den ATS-Filtern vorbei

Zusammenfassung

NXP Semiconductors N.V. in Austin, TX, seeks a Principal Device / Process Integration Engineer to own products from substrate through wafer test in a full-time, first-shift role.

You will collaborate with Product Engineering to introduce new products into manufacturing, drive yield and cost improvements, and monitor device performance against specs while leading cross-functional teams to resolve excursions.

Qualifikationen

  • Bachelor’s degree in Electrical or related science; Master’s preferred.
  • Minimum 6 years in device/process engineering or similar role.
  • Experience with DOE and SPC.
  • Strong data analysis and communication skills.
  • Ability to plan and deliver projects on schedule.
  • Proficient in Excel, JMP, Word, and PowerPoint.

Aufgaben

  • Collaborate with Product Engineering to introduce new products into manufacturing.
  • Drive yield and cost improvements via process integration enhancements.
  • Monitor electrical device performance to meet quality specs.
  • Lead cross-functional teams to improve manufacturing efficiency and handle excursions.
  • Communicate complex issues clearly and present solutions to varied audiences.
  • Provide real-time, innovative solutions to support manufacturing needs with top quality.

Kenntnisse

DOE & SPC
Data analysis
Troubleshooting
Teamwork & comms
Planning & delivery

Ausbildung

Bachelor’s degree
Master’s preferred

Tools

Excel
JMP
Word
PowerPoint

Jobbeschreibung

NXP Semiconductors N.V. in Austin, TX, seeks a Principal Device / Process Integration Engineer to own products from substrate through wafer test in a full-time, first-shift role.

You will collaborate with Product Engineering to introduce new products into manufacturing, drive yield and cost improvements, and monitor device performance against specs while leading cross-functional teams to resolve excursions.

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