Senior/Principal PM — 3D Microelectronics Platforms

Phase2 Technology

Austin (TX)

On-site

USD 140,000 - 190,000

Full time

14 days+

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Benefits offered by this job

Competitive health benefits
Tuition assistance
Training access via LinkedIn Learning

Job summary

The University of Texas at Austin is seeking a Senior/Principal Product Manager for its Texas Institute for Electronics (TIE) to drive the product strategy for advanced 2.5D/3D microsystems platforms. This role bridges engineering execution with market needs, coordinating cross-functional teams and strategic partnerships to accelerate platform success.

You will own PRDs, guide EDA integration, and lead collaboration with packaging R&D, process engineering, and design automation to deliver on

Qualifications

  • Bachelor’s degree in Electrical or Computer Engineering or related technical discipline.
  • 5+ years in semiconductor packaging, microsystems or related product development (Senior).
  • 10+ years in similar roles (Principal).
  • Strong knowledge of advanced packaging ecosystems and market trends.

Responsibilities

  • Own the product strategy and roadmap for 2.5D/3D microsystems platforms.
  • Draft and maintain PRDs guiding process development and packaging engineering.
  • Lead cross-functional collaboration across R&D, design, and product marketing.
  • Engage customers and industry partners to align capabilities with needs.
  • Act as a technical champion for 2.5D/3D integration and liaison in reviews.

Skills

Exceptional communication
Startup DNA
Execution mindset

Education

BS in Electrical/Computer Engineering or related
MS or PhD (preferred)

Tools

EDA familiarity
PDK/ADK knowledge
Design automation

Job description

The University of Texas at Austin is seeking a Senior/Principal Product Manager for its Texas Institute for Electronics (TIE) to drive the product strategy for advanced 2.5D/3D microsystems platforms. This role bridges engineering execution with market needs, coordinating cross-functional teams and strategic partnerships to accelerate platform success.

You will own PRDs, guide EDA integration, and lead collaboration with packaging R&D, process engineering, and design automation to deliver on

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