Design Engineer - Timing Methodology

Broadcom Inc.; Wayne (CA); On-site; USD 144,000 - 230,000; Full time

Benefits offered by this job

Medical, dental and vision plans

401K with company matching

Employee Stock Purchase Program (ESPP)

Employee Assistance Program (EAP)

paid holidays

paid sick leave and vacation

Job summary

Broadcom Inc. is seeking an experienced engineer to advance timing sign-off methodologies for SOC and 3D/2.5D IC design. The role requires ownership of timing signoff and collaboration across teams in a fast-paced project environment.

You will deploy methodologies, lead EDA flow with Primetime, Tempus and Innovus, and contribute to silicon technology yield and testability improvements.

Qualifications

• BS degree in EE/CS with 12+ years of industry experience or MS/PhD with 10+ years.
• Strong hands-on experience in Timing Signoff methodology development and ownership.
• Strong hands-on experience in SOC and 3D/2.5D IC timing signoff.
• Experience with statistical data analysis and modeling.
• Experience with silicon technologies, testability and yield.
• Experience with industry standard STA tools such as Primetime and Tempus.
• Proficient in scripting: TCL, Python, Perl, and Unix shell.
• Excellent communication, coordination and problem-solving abilities.

Responsibilities

• Develop and deploy timing signoff methodologies for advanced technology nodes.
• Design and implement SOC, 3D/2.5D IC & multi-die signoff solutions.
• Participate and lead in EDA flow development for Primetime, Tempus & Innovus.

Skills

Timing signoff ownership

Strong communication

Multitasking & context switching

Team player

Education

BS EE/CS +12+ years

MS/PhD EE/CS +10+ years

Tools

Primetime

Tempus

Innovus

TCL scripting

Python

Perl

Unix shell

Job description

Broadcom's Timing Sign-Off group in Central Engineering is looking for an energetic and self-driven professional to join our team. Our group’s mission is to provide advanced timing sign-off methodologies to Broadcom’s chip teams with the goal of achieving best in class solutions with high yield and fully optimized margins. The candidate will participate and take ownership in Advanced Timing Sign-off methodology development and modeling for SOC and 3D/2.5D IC design. This includes complex studies and analysis of new concepts leading to design, development and improvement of existing and new solutions. The candidate should have experience in methodology development with deep knowledge of advanced silicon technologies, production testability and yield. The candidate should have Tapeout experience in high volume / high yield complex SOCs at advanced technology nodes. The candidate will be working closely with other experts across the company in a fast paced project oriented agile environment. The candidate must have the ability to prioritize well, communicate clearly, proactively deliver practical and quality solutions on-time, work well with external and internal partners, and possess advanced IC design engineering skills. The candidate will be expected to work across multiple facets of projects and juggle multiple responsibilities at the same time.

Responsibilities

• Develop and deploy timing signoff methodologies for advanced technology nodes.
• Design and implement SOC, 3D/2.5D IC & multi-die signoff solutions.
• Participate & Lead in EDA flow development for Primetime, Tempus & Innovus.

Qualifications

• The minimum engineering experience required is typically a BS degree in EE/CS with 12+ years of industry experience, or an MS degree or Ph.D. degree in EE/CS with 10+ years of industry experience.
• Strong hands-on experience in Timing Signoff methodology development and ownership.
• Strong hands-on experience in SOC and 3D/2.5D IC timing signoff.
• Strong hands-on experience with statistical data analysis and modeling.
• Strong hands-on experience in silicon technologies, testability and yield.
• Strong hands-on experience with industry standard STA tools such as Primetime and Tempus.
• Strong hands-on experience developing scripts in TCL, Python, Perl, Unix shell and flow automation.
• Experience with revision control, issue management/defect tracking, continuous integration, and continuous delivery/deployment tools.
• Strong analytical skills and extremely detail oriented, organized and methodical.
• Strong communication skills. Clear and concise.
• Strong multitasking and context switching skills.
• Optimistic yet pragmatic attitude.
• Demonstrable skills for quick ramp-up.
• Ability to stay calm under extreme pressure.
• Team player.
• Able to work with minimum supervision, handle ambiguity and drive problem solving to resolution autonomously.

Compensation and Benefits

The annual base salary range for this position is USD 143,800.00 To USD 230,000.00. As a valued member of our team, you'll be eligible for a discretionary annual bonus and the opportunity to receive not only a competitive new hire equity grant, but also annual equity awards, connecting your success directly to the company's growth. All subject to relevant plan documents and award agreements.

• Medical, dental and vision plans
• 401(K) participation including company matching
• Employee Stock Purchase Program (ESPP)
• Employee Assistance Program (EAP)
• company paid holidays
• paid sick leave and vacation time

The company follows all applicable laws for Paid Family Leave and other leaves of absence.

Broadcom is proud to be an equal opportunity employer. We will consider qualified applicants without regard to race, color, creed, religion, sex, sexual orientation, national origin, citizenship, disability status, medical condition, pregnancy, protected veteran status or any other characteristic protected by federal, state, or local law. We will also consider qualified applicants with arrest and conviction records consistent with local law.

If you are located outside USA, please be sure to fill out a home address as this will be used for future correspondence.

Welcome! Thank you for your interest in Broadcom! We are a global technology leader that designs, develops and supplies a broad range of semiconductor and infrastructure software solutions. For more information please visit our video library and check out our Connected by Broadcom series.