Compact Device Modeling Engineer (CMOS SPICE)

Global Foundries; Austin (TX); On-site; USD 58,000 - 101,000; Full time

Benefits offered by this job

Competitive salary

Job summary

GlobalFoundries is seeking a Device Compact Modeling Engineer to develop SPICE models for digital, analog, and RF devices in GF CMOS technologies. The role involves cross-functional collaboration across technology development, characterization, PDK, and design enablement teams to deliver accurate, production-ready models for internal and external customers.

The candidate should have a BS in Electrical Engineering or related field, a minimum 3.0 GPA, and strong English communication skills.

Qualifications

• Bachelor's degree in Electrical Engineering, Physics or related field from an accredited program.
• Must have at least a 3.0 GPA and good academic standing.
• English proficiency (written & verbal).
• Fundamental semiconductor device physics knowledge related to compact modeling.

Responsibilities

• Develop SPICE models for digital, analog, and RF devices for GF CMOS technologies.
• Drive data selection, model extraction, QA, validation, and benchmarking across platforms.
• Coordinate cross-functional teams to execute model-related projects and resolve issues.

Skills

SPICE modeling

Python

Perl

Communication

Machine learning

RF design

Project management

Education

Bachelor's in Electrical Engineering or related field

Tools

SPICE

PDK

EDA tools

Job description

GlobalFoundries is seeking a Device Compact Modeling Engineer to develop SPICE models for digital, analog, and RF devices in GF CMOS technologies. The role involves cross-functional collaboration across technology development, characterization, PDK, and design enablement teams to deliver accurate, production-ready models for internal and external customers.

The candidate should have a BS in Electrical Engineering or related field, a minimum 3.0 GPA, and strong English communication skills.