CMP Applications Engineer - Customer Solutions

2261 DuPont Electronic Materials CMP, LLC

Newark (NJ)

On-site

USD 90,000 - 120,000

Full time

14 days+
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Job summary

Qnity is seeking a candidate to lead new pad development and application support for customers in advanced electronics. You will develop and transfer product and process knowledge to customers and local teams, driving early-stage troubleshooting and customization.

The role interfaces with marketing, product teams, and field service, and requires travel up to 20% as part of global support and process optimization efforts.

Qualifications

  • Three years semiconductor experience or relevant process development/customer engagement experience.
  • Minimum B.S. in Chem, Chem E, Mech E, Materials Science/Engr or related engineering degree
  • Preferred CMP, advanced packaging, and/or semiconductor fabrication experience; DOE and data analysis knowledge
  • Effective communication/interpersonal skills; ability to work cross-functionally
  • Knowledge of semiconductor fabrication metrology and procedures

Responsibilities

  • Develop expertise in new products prior to market introduction.
  • Lead development of baseline processes and data packages for product commercialization.
  • Transfer product expertise to customers and local technical support teams.
  • Support customers in troubleshooting and customize processes to requirements.
  • Participate in safety activities; ensure compliance with company practices.
  • Troubleshoot issues at customer sites and document results.

Skills

Semiconductor experience
Process development
Customer engagement
Communication skills

Education

B.S. in Chemistry, Chemical Engineering, Mechanical Engineering, Materials Science/Engr

Tools

DOE
Statistical data analysis
Technical reporting

Job description

Qnity is seeking a candidate to lead new pad development and application support for customers in advanced electronics. You will develop and transfer product and process knowledge to customers and local teams, driving early-stage troubleshooting and customization.

The role interfaces with marketing, product teams, and field service, and requires travel up to 20% as part of global support and process optimization efforts.

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