Chiplet Architect - Mixed-Signal IC Leadership

Analog Devices; Durham (NC); On-site; USD 157,000 - 227,000; Full time

Benefits offered by this job

Discretionary bonus

Medical, vision and dental coverage

401k plan

Paid vacation and holidays

Job summary

Analog Devices, Inc. in the United States seeks a highly skilled Mixed-signal IC Chiplet Architect to lead the definition, design, and integration of next-generation chiplet-based analog and mixed-signal transceivers.

This role requires deep architectural leadership from concept through product delivery, working with design, packaging, verification, software, firmware, and test teams. The ideal candidate will guide system-level specifications, sub-system requirements, and fast configuration

Qualifications

• MS or PhD in Electrical Engineering or Systems Engineering.
• 10+ years in analog/mixed-signal IC design with chiplet/multi-die architecture.
• Track record delivering high-performance analog ICs.
• Experience with advanced packaging and chiplet-based integration.

Responsibilities

• Define architecture of analog and mixed-signal chiplets for heterogeneous integration.
• Lead design teams in integrating analog blocks (RFADCs/RFDACs, bias circuits, clocks, PLLs, LDOs).
• Coordinate with digital, RF, and packaging teams for chiplet interoperability.
• Oversee system-level verification and multi-chiplet simulations.
• Drive roadmapping and stay ahead of industry trends in chiplet architectures.

Skills

Analog IC design

Mixed-signal design

Chiplet architecture

System-level thinking

Leadership

Communication

EDA tools

Die-to-die interconnects

Education

MS or PhD in Electrical or Systems Engineering

Tools

EDA tools

Packaging tools

Job description

Analog Devices, Inc. in the United States seeks a highly skilled Mixed-signal IC Chiplet Architect to lead the definition, design, and integration of next-generation chiplet-based analog and mixed-signal transceivers.

This role requires deep architectural leadership from concept through product delivery, working with design, packaging, verification, software, firmware, and test teams. The ideal candidate will guide system-level specifications, sub-system requirements, and fast configuration