Camera Hardware Design Engineer – Miniature Modules

Apple Inc.; Cupertino (CA); Sur place; USD 184 700 - 324 800; Plein temps

Résumé du poste

Apple seeks an extraordinary Hardware Engineer to lead camera hardware projects, developing high-performance compact camera modules from sensor to lens. You will own mechanical designs, packaging, and validation in collaboration with product teams.

The role requires 3+ years in miniature component or opto-mechanical module design for high-volume products, with expertise in CAD, FEA, and tolerance analysis. VCM experience is a plus.

Qualifications

• Bachelor's degree in Mechanical Engineering or related field.
• CAD 3D modeling and drafting experience.
• FEA experience in structural and thermal analysis.

Responsabilités

• Design camera module structures and packaging in CAD.
• Design injection molded, sheet metal, PCB, and other components.
• Author detailed 2D manufacturing and inspection drawings.
• Perform tolerance analysis of module designs and parts.
• Work with partners on design manufacturability and issues.
• Direct FEA engineers on evaluation of camera designs.

Connaissances

CAD 3D modeling

FEA

Tolerance analysis

Mechanical design

VCM knowledge

Leadership

NX exposure

Materials selection

Formation

Bachelor's degree in Mechanical Engineering or related field

Outils

NX

CAD software

Description du poste

Apple seeks an extraordinary Hardware Engineer to lead camera hardware projects, developing high-performance compact camera modules from sensor to lens. You will own mechanical designs, packaging, and validation in collaboration with product teams.

The role requires 3+ years in miniature component or opto-mechanical module design for high-volume products, with expertise in CAD, FEA, and tolerance analysis. VCM experience is a plus.