BEOL Process Integration Engineer - Analog CMOS (Cu/Al)

118-WW TMG MFG OPS; Lenexa (KS); On-site; USD 110,000 - 140,000; Full time

Job description

BEOL Process Integration Engineer

We’re at the forefront of an exciting advanced Analog 300 mm development in SM fab located in Sherman, TX. We are looking for an experienced BEOL Process Integration (PI) Engineer, to join our team. This engineer will be an invaluable part of the team and in this role, you will drive the integration and development of the overall BEOL, for existing and future analog & CMOS nodes, interfacing and communicating with ATD (Advanced Technology Development), Process engineering, Parametric Test engineering, Product development, Quality and Manufacturing groups across the organization.

Primary responsibilities will include:

• Ownership of the process flow for BEOL (Al and Cu) that meets physical, electrical, yield and reliability targets
• Working closely with the unit process development group to design experiments to evaluate multiple integration options and arrive at an optimized, manufacturable and cost-effective solution
• Partnering with the RET team to validate OPC and make improvements, as appropriate
• Collaborating with ATD and other groups to ensure silicon process is compatible with parametric, multiprobe, test and packaging robustness requirements

As part of this role, you will be accountable for delivering technology solutions on time that meet product requirements.

The person performing this role must be capable of planning effectively, drive schedules, meet critical deadlines on multiple tasks in parallel, lead technical discussions in their area of expertise, and work effectively across organizational boundaries. They must be able to clearly communicate project status and actions. Additionally, they must be able to interface with multiple organizations and work well on a diverse team to accomplish goals.

Minimum requirements:

• Bachelors degree in EE, Chemical Engineering, Materials Science & Engineering, Physics, Chemistry
• 5 years of Process Integration experience in CMOS or analog technology with hands-on experience developing Cu BEOL

Preferred qualifications:

• Masters or Ph.D. degree in Electrical Engineering, Materials Science & Engineering, or related degree
• Experience with technology development for <65 nm BEOL, low-k dielectrics, RRAM (Resistive Random Access Memory), TFR (Thin Film Resistor), MIMCAP (Metal-Insulator-Metal Capacitor)
• Demonstrated experience and ability to plan effectively, drive schedules, meet critical deadlines on multiple tasks in parallel, lead technical discussions in their area of expertise, and work effectively across organizational boundaries
• Ability to establish strong relationships with key stakeholders critical to success, both internally and externally
• Strong verbal and written communication skills
• Ability to quickly ramp on new systems and processes
• Demonstrated strong interpersonal, analytical and problem-solving skills
• Ability to work in teams and collaborate effectively with people in different functions
• Ability to take the initiative and drive for results
• Strong time management skills that enable on-time project delivery