Avionics Electronics Packaging Engineer — TS/SCI Eligible

BOAB Ventures; Carlsbad (CA); On-site; USD 90,000 - 140,000; Full time

Job summary

BOAB Ventures is seeking an Electronic Packaging Mechanical Engineer (Avionics) for on-site work at one of three client sites: Chantilly, VA; Palm Bay, FL; or Carlsbad, CA. You will lead mechanical design and integration of rugged avionics assemblies from concept through test, collaborating with thermal/structural analysts and program teams.

The ideal candidate has a strong background in packaging electronics for rugged environments, with a Bachelor's degree in engineering and TS/SCI clearance.

Qualifications

• Bachelor's degree in engineering with 4+ years of relevant experience; Master's with 2+ years; or 8+ years of relevant experience in lieu of a degree.
• Experience packaging electronics for rugged environments.
• Active TS/SCI clearance.

Responsibilities

• Create complex mechanical designs and layouts for multiple products from high level requirements.
• Package circuit cards, connectors, and cables; integrate in rugged environments.
• Develop, integrate, and validate mechanical, electro-mechanical, and opto-mechanical designs.
• Support thermal, fluid, structural, and power analyses and propose solutions.
• Support prototyping, testing, and troubleshooting of designs.
• Design additively manufactured parts, machined parts, weldments, sheet metal parts, and cable assemblies.
• Develop design control documentation.
• Collaborate with outside vendors and cross-functional teams to source parts and develop solutions.

Skills

Rugged electronics packaging

Active TS/SCI clearance

Education

Bachelor's degree in engineering

Master's degree in engineering

8+ years of experience in lieu of degree

Job description

BOAB Ventures is seeking an Electronic Packaging Mechanical Engineer (Avionics) for on-site work at one of three client sites: Chantilly, VA; Palm Bay, FL; or Carlsbad, CA. You will lead mechanical design and integration of rugged avionics assemblies from concept through test, collaborating with thermal/structural analysts and program teams.

The ideal candidate has a strong background in packaging electronics for rugged environments, with a Bachelor's degree in engineering and TS/SCI clearance.